Multilayer Ceramic Capacitor With Polymer Layer And Localized Margin
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer ceramic capacitors face limitations in increasing the area of the overlapped portion between internal electrodes, which restricts capacitance and reliability due to thick margin portions and vulnerability to carbon removal during firing.
Innovation Solution
A multilayer ceramic capacitor design with internal electrodes exposed on specific side surfaces and a polymer layer on the ceramic body and external electrodes, along with a plating layer on certain regions, to enhance the overlapped area and reduce step formation, improving capacitance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the area of the overlapped portion between internal electrodes is increased to improve capacitance, then the capacitance increases, but the margin portion becomes thinner making carbon removal difficult during firing
Solution Approach 1:
The patent applies local quality by forming a thicker margin portion at the corner regions of the ceramic body where carbon removal is most difficult. This localized thickness variation allows the overlapped area between internal electrodes to be increased for higher capacitance while maintaining sufficient margin thickness at corners for effective carbon removal during firing.
Solution Approach 2:
The patent transitions from a two-dimensional planar electrode layout to a three-dimensional structure with varied margin thickness. By creating corner portions with greater thickness than the main body margin portions, the design adds a vertical dimension to solve the conflict between maximizing electrode overlap area and ensuring adequate margin for carbon removal.
2Quantity of substance
If the dielectric layer is thinned to increase capacitance, then the capacitance increases, but the structural integrity and reliability may be compromised
Solution Approach 1:
The patent applies local quality by creating corner portions with greater thickness than the main body regions. This localized thickening at corners provides enhanced structural support and reliability while allowing the dielectric layer in the main capacitance-forming regions to be thinner for higher capacitance.
3Quantity of substance
If the margin portion is made thinner to increase electrode overlap area, then the capacitance increases, but the vulnerability to carbon removal during firing increases
Solution Approach 1:
The patent applies local quality by forming corner portions with greater margin thickness specifically at regions where carbon removal is most critical. This localized thickening protects against carbon removal harmful effects while maintaining thin margins in other areas to maximize electrode overlap and capacitance.
Solution Approach 2:
The patent applies preliminary anti-action by pre-forming thicker corner portions before the firing process. This preliminary structural reinforcement prevents the harmful effect of carbon removal during firing by providing adequate margin thickness in advance at the most vulnerable locations.
Data Source
AI summary
There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces opposing each other and third and fourth end surfaces connecting the first and second side surfaces, first and second internal electrodes formed in the ceramic body and having one ends exposed to the first and second side surfaces and the third end surface or exposed to the first and second side surfaces and the fourth end surface, first and second external electrodes formed on an outer side of the ceramic body and electrically connected to the first and second internal electrodes, and a plating layer partially formed on certain regions of the first and second external electrodes, wherein a polymer layer is additionally formed on the ceramic body on regions of upper portions of the first and second external electrodes on which the plating layer is not formed.


