Multilayer Ceramic Capacitor Protrusion Electrode Adhesion

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in achieving high adhesive strength, ease of shape control, and humidity-resistance reliability, particularly in miniaturized electronic devices and electric vehicle components, where conventional external electrode structures are insufficient for meeting increasing industry standards.

Innovation Solution

A multilayer electronic component design featuring a body with alternately stacked dielectric and internal electrode layers, including protrusions on the surfaces to support external electrodes and conductive resin layers, which enhance adhesive strength, shape control, and humidity resistance by creating a complex permeation path for plating liquids and external forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional external electrode structure is used, then the device structure is simple, but the adhesive strength of the electrode layer is insufficient

Engineering Contradiction:
Improveadhesive strengthVSAvoidelectrode structure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The external electrode is segmented into multiple functional layers: a base electrode layer and an additional conductive resin layer. This segmentation allows each layer to perform its specific function - the electrode layer provides electrical conductivity while the conductive resin layer enhances adhesion and absorbs external impacts, thereby resolving the contradiction between maintaining structural simplicity and improving adhesive strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The external electrode uses a composite structure combining metallic electrode material with conductive resin material. This composite approach leverages the electrical conductivity of metals and the adhesive properties of resins, achieving both strong adhesion and electrical functionality without excessive structural complexity.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the electrode layer is extended to improve coverage, then the electrical connectivity is improved, but the shape control becomes difficult

Engineering Contradiction:
Improveelectrical connectivityVSAvoidshape control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The conductive resin layer acts as an intermediary between the electrode layer and the external environment. It allows the electrode layer to maintain its precise manufactured shape while the resin extends the conductive pathway and improves connectivity. This intermediary layer resolves the contradiction by decoupling shape control requirements from electrical connectivity requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If the electrode layer is made thinner to reduce size, then the miniaturization is achieved, but the adhesive strength decreases

Engineering Contradiction:
Improvecomponent sizeVSAvoidadhesive strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

Instead of increasing the thickness of the electrode layer in the vertical dimension to improve adhesion, the solution adds a conductive resin layer that extends in horizontal dimensions. This dimensional shift allows the thin electrode layer to maintain its miniaturized profile while the resin layer provides the necessary adhesive strength and impact absorption in a different spatial configuration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If a single-layer electrode structure is used, then the manufacturing process is simple, but the humidity resistance reliability is insufficient

Engineering Contradiction:
Improvehumidity resistanceVSAvoidelectrode layer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive resin layer serves as a protective cushion applied beforehand to shield the electrode layer from humidity and plating liquid penetration. This pre-protective layer prevents harmful environmental factors from reaching the electrode, thereby improving humidity resistance without requiring complex multi-layer protective structures.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS11361904B2Multilayer electronic component
Publication Date: 2022.06.14 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11361904B2 patent drawing
  • US11361904B2 patent drawing
  • US11361904B2 patent drawing

AI summary

A multilayer electronic component includes a body, a protrusion disposed on at least one surface of the body, and an external electrode having an electrode layer disposed on a side surface of the body and extending to be in contact with a side surface of the protrusion and a conductive resin layer disposed on the electrode layer and extending to cover a portion of the protrusion.