Multilayer Ceramic Capacitor Resin Layer Interface Separation
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Solution Overview
Problem
Multilayer ceramic capacitors face reliability issues due to interface separation between conductive resin layers and plated layers, particularly during mounting on boards, which affects their performance and reliability, especially in high-reliability applications like vehicles and high-voltage products.
Innovation Solution
A multilayer ceramic capacitor design incorporating a ceramic body with dielectric layers and internal electrodes, an electrode layer, a first composite resin layer with copper or silver conductive powder, a second composite resin layer with nickel conductive powder, and a plated layer with a tin intermetallic compound formed between the second composite resin layer and the plated layer, reducing interface separation and enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer is applied between the electrode layer and plated layer to absorb external shocks and prevent plating solution permeation, then reliability is improved, but interface separation occurs between the electrode layer and conductive resin layer or between conductive resin layer and plated layer
Solution Approach 1:
The conductive resin layer is divided into two separate layers: a first conductive resin layer containing copper or silver powder disposed on the electrode layer, and a second conductive resin layer containing nickel powder disposed on the first conductive resin layer. This segmentation prevents interface separation by creating distinct functional layers with appropriate material properties for each interface.
Solution Approach 2:
The invention uses composite resin layers combining organic resin with conductive metal powders (copper/silver in the first layer, nickel in the second layer). These composite materials provide both electrical conductivity and mechanical adhesion properties, preventing interface separation while maintaining reliability.
2Reliability
If the number of stacked dielectric layers is increased to achieve higher capacitance, then capacitance is improved, but the capacitor size increases
Solution Approach 1:
The invention changes the material parameters of the conductive resin layers, specifically using copper or silver powder in the first layer and nickel powder in the second layer. This parameter optimization improves electrical conductivity and adhesion, enabling higher capacitance density without proportionally increasing size.
3Volume of moving object
If external electrodes are thinned to reduce capacitor size, then miniaturization is achieved, but mechanical strength and reliability are reduced
Solution Approach 1:
The invention uses composite resin layers with conductive metal powders to replace or supplement traditional metal electrode structures. The organic resin matrix provides mechanical strength while the conductive powder maintains electrical functionality, enabling thinner electrodes without sacrificing strength.
Solution Approach 2:
The electrode structure is segmented into multiple functional layers (electrode layer, first conductive resin layer, second conductive resin layer, plated layer), distributing mechanical and electrical functions across layers. This allows each layer to be optimized for its specific function, enabling overall miniaturization while maintaining strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces interface separation between the external electrode layers and the resin layers, improving the reliability and mounting efficiency of multilayer ceramic capacitors, while also providing environmental benefits by minimizing nickel plating wastewater.
Implementation Method 1
an intermetallic compound formed in a region in which the second composite resin layer and the plated layer contact. The intermetallic compound may be formed by a reaction between the second conductive powder and a metal included in the plated layer.
Data Source
AI summary
A multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.