Multilayer Ceramic Capacitor Ridge Structure for Crack-Resistant Mounting
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Solution Overview
Problem
The reduction in size and increased functionality of electronic devices lead to a decrease in mechanical strength of multilayer ceramic capacitors, making them prone to cracks during the reflow soldering process, especially when the ridge line of the ceramic element body collides with the substrate or electrode.
Innovation Solution
The design of multilayer ceramic capacitors with specific R dimensions of ridge lines on the mounting surface and the use of embossed holes on the second main surface to mitigate impact and prevent cracks, along with a unique configuration of internal and external electrodes that enhance mechanical strength and mounting resilience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of multilayer ceramic capacitors is reduced to meet miniaturization requirements, then the size of the capacitor is reduced, but the mechanical strength against external force decreases
Solution Approach 1:
The patent applies local quality by creating a recessed portion specifically at the ridge line of the mounting surface, concentrating structural reinforcement where the mounting collision occurs. This localized modification allows the overall capacitor to remain thin while providing enhanced mechanical strength at the critical mounting area, resolving the contradiction between miniaturization and mechanical strength.
2Volume of moving object
If the thickness of multilayer ceramic capacitors is reduced, then the capacitor size is reduced, but the occurrence of cracks during mounting increases
Solution Approach 1:
The patent implements beforehand cushioning by pre-forming a recessed portion at the ridge line of the mounting surface before the mounting process. This recessed structure acts as a cushion that absorbs collision impact during reflow soldering, preventing cracks in the ceramic element body even when the capacitor is thin. The cushioning effect is built into the structure in advance, addressing the reliability issue before mounting occurs.
3Ease of manufacture
If the ridge line of the ceramic element body collides with the substrate during mounting, then the mounting process is simple, but cracks occur in the ceramic element body
Solution Approach 1:
The patent converts the harmful collision impact into a beneficial effect by designing the ridge line with a recessed portion. When the ridge line collides with the substrate during mounting, the recessed structure causes the collision to occur at a lower point, distributing the impact force and preventing cracks. This transforms the potentially harmful direct collision into a beneficial cushioned contact that protects the ceramic element body.
Data Source
AI summary
A multilayer ceramic capacitor includes first and second internal electrodes, first and second main surfaces opposed to each other, first and second end surface opposed to each other, and first and second lateral surfaces opposed to each other, and first and second external electrodes on an outer surface of the ceramic element body. Each of the first internal electrodes is electrically connected with the first external electrode. Each of the second internal electrodes is electrically connected with the second external electrode. When a cross section is viewed, the first external electrode has an L-shape on the first end surface and the first main surface, and the second external electrode has an L-shape on the second end surface and the first main surface.