Multilayer Ceramic Capacitor Rounded Corners Prevent Toppling
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Solution Overview
Problem
Multilayer ceramic electronic components face defects such as toppling over when mounted on a board and chipping due to excessive or insufficient polishing of ceramic body corners, affecting reliability and capacitance.
Innovation Solution
A multilayer ceramic capacitor with a hexahedral ceramic body having dielectric layers and internal electrodes, where at least one corner is rounded with a curvature radius between 0.01 and 0.07 times the thickness, ensuring secure mounting and preventing chipping defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of dielectric layers is reduced and the number of stacked layers is increased to achieve high capacitance and miniaturization, then the capacitance and miniaturization are improved, but the component becomes top-prone when mounted on a board
Solution Approach 1:
The patent applies curvature by rounding the corners and vertexes of the ceramic body. This spherical/curved modification at critical points prevents the component from toppling during mounting while maintaining the overall miniaturized structure with high layer stacking density for high capacitance.
2Reliability
If corner polishing is performed to prevent chipping defects, then chipping prevention is improved, but the corners may be excessively or insufficiently polished affecting reliability
Solution Approach 1:
The patent specifies precise parameter ranges for corner polishing: radius of curvature between 0.005T and 0.07T (where T is ceramic body thickness). This parameter control ensures consistent polishing quality that prevents both excessive and insufficient polishing, thereby preventing chipping while maintaining manufacturing precision.
3Volume of moving object
If the ceramic body dimensions are reduced for miniaturization, then the size is reduced, but the component becomes more susceptible to toppling during mounting
Solution Approach 1:
By rounding corners and vertexes of the miniaturized ceramic body, the patent creates a shape that is less prone to toppling during mounting. The curved surfaces distribute mechanical stresses more effectively and prevent the sharp edges that would catch or pivot during the mounting process, thus maintaining stability despite reduced overall dimensions.
Data Source
AI summary
There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W1.0 when a length of the ceramic body is defined as L, a width of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers interposed therebetween.