Multilayer Ceramic Capacitor with Shielding Layer for ESL Reduction
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Solution Overview
Problem
There is a need for multilayer ceramic capacitors that can effectively reduce equivalence series inductance (ESL) and provide high electromagnetic interference (EMI) shielding performance, particularly in the context of voltage fluctuations and high frequencies in electronic components like CPUs.
Innovation Solution
The design incorporates a multilayer ceramic capacitor structure with stacked dielectric layers, external and internal electrodes, conductive vias, and a shielding layer to reduce ESL and enhance EMI shielding. The capacitors have external electrodes disposed on one surface, with conductive vias connecting internal electrodes to external electrodes, and a shielding layer covering the external surface to prevent EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional multilayer ceramic capacitor structure is used, then the basic capacitance function is achieved, but the equivalence series inductance (ESL) is high and EMI shielding performance is insufficient
Solution Approach 1:
The capacitor structure is segmented into multiple functional zones: internal electrodes for capacitance, conductive vias for low-inductance connection, and a shielding layer for EMI protection. This segmentation allows each component to be optimized for its specific function, reducing overall ESL while maintaining capacitance.
Solution Approach 2:
The patent introduces a vertical dimension by stacking dielectric layers with internal electrodes in multiple layers, and adding conductive vias that extend through the thickness of the capacitor. This three-dimensional arrangement reduces current path length and inductance compared to traditional planar structures.
2Object-affected harmful factors
If EMI shielding is added to passive components, then EMI shielding performance is improved, but device complexity increases
Solution Approach 1:
The shielding layer is merged with the external electrode structure, forming an integrated design where the shielding function is incorporated into the existing capacitor architecture rather than being added as a separate component. This reduces overall device complexity while achieving EMI shielding.
Solution Approach 2:
The conductive vias serve multiple functions: they provide electrical connection between internal and external electrodes, and simultaneously act as part of the shielding structure. This multi-functionality reduces the need for separate shielding components, simplifying the overall device structure.
Data Source
AI summary
A multilayer ceramic capacitor includes a body in which a plurality of dielectric layers are stacked, first and second external electrodes disposed on one surface of the body and spaced apart from each other, a plurality of first and second internal electrodes opposing each other, the dielectric layers being interposed therebetween, a first conductive via connecting the plurality of first internal electrodes to the first external electrode, a second conductive via connecting the plurality of second internal electrodes to the second external electrode, and a shielding layer covering at least a portion of an external surface of the body.