Multilayer Ceramic Component Silicon Ratio Shrinkage
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in miniaturization and high capacitance due to differences in shrinkage behavior between internal electrodes and dielectric layers, leading to reduced connectivity and reliability, especially when internal electrodes are thinned, and the use of ceramic common materials can compromise compactness and reliability.
Innovation Solution
Incorporating silicon (Si) into both the internal electrodes and dielectric layers with a specific Si content ratio (0.99 to 1.41 wt%) to improve electrode connectivity and capacitance, while maintaining reliability and moisture resistance, by adjusting the Si content in both components to enhance sintering and electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal electrode is thinned to achieve miniaturization and high capacitance, then the capacitance and miniaturization are improved, but the electrode connectivity decreases due to intensified shrinkage stress differences
Solution Approach 1:
The patent changes the chemical composition parameters of the internal electrode by adding silicon (Si) and controlling the ratio of Si content in the internal electrode to Si content in the dielectric layer to be within 0.99-1.41. This parameter adjustment modifies the shrinkage behavior of the internal electrode during sintering, reducing the shrinkage stress difference with the dielectric layer and improving electrode connectivity while maintaining thinned electrode geometry for miniaturization and high capacitance
Solution Approach 2:
The patent creates a composite structure by incorporating silicon (Si) into the internal electrode material, forming a composite of conductive metal and silicon. This composite material approach allows the internal electrode to have modified shrinkage characteristics that better match the dielectric layer, reducing stress and improving connectivity while maintaining the thinned electrode design
2Reliability
If ceramic common material is added to the internal electrode paste to delay shrinkage initiation temperature, then the shrinkage stress is reduced, but the compactness of the internal electrode decreases due to ceramic common material being pushed out to the dielectric layer
Solution Approach 1:
The patent changes the compositional parameters by using silicon (Si) as an additive in the internal electrode paste and controlling its content ratio relative to the dielectric layer. This parameter control allows the internal electrode to delay shrinkage initiation and reduce shrinkage stress while maintaining compactness, avoiding the problem of ceramic common material being pushed out to the dielectric layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach significantly improves electrode connectivity, increases capacitance, and enhances the electrical and moisture resistance reliability of multilayer ceramic electronic components, addressing the issues of shrinkage and reliability associated with thinned internal electrodes.
Implementation Method 1
the conductive metal constituting the internal electrode and a dielectric layer have a difference in shrinkage behavior therebetween at the time of being sintered. The difference in shrinkage behavior between the internal electrode and the dielectric layer generates stress
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes, wherein the dielectric layer includes silicon (Si), each of the first and second internal electrodes includes Si and a conductive metal, and a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.