Multilayer Ceramic Capacitor Side Gap Formation Method
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Solution Overview
Problem
Existing methods for manufacturing thin multilayer ceramic capacitors face challenges in forming side gaps on both side surfaces, making it difficult to rotate and increasing the risk of damage when bent.
Innovation Solution
A method involving the stacking of multilayer bodies via a binder, followed by rotation and the creation of side gaps on both side surfaces, which are then reinforced by external electrodes, allowing for easier formation and enhanced resistance to bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thin multilayer chip is pressed by an adhesive sheet and a working plate to form a side gap, then one side surface with the side gap is formed, but the multilayer chip cannot be easily rotated and it is difficult to form a side gap on the other side surface
Solution Approach 1:
The invention divides the multilayer chip into multiple segments by forming side gaps on both side surfaces, allowing independent manipulation and assembly of each segment. This segmentation enables the chip to be more easily handled and positioned during mounting without requiring complex rotation operations.
Solution Approach 2:
The invention transitions from forming side gaps on only one side surface (2D approach) to forming side gaps on both side surfaces (3D approach). By utilizing both side surfaces of the multilayer chip, the manufacturing process becomes more efficient and the chip structure gains additional degrees of freedom for positioning and assembly.
2Strength
If side gaps are formed on both side surfaces of a thin multilayer ceramic capacitor, then resistance to bending is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The side gaps are formed on both side surfaces before the final assembly and mounting steps. By performing this strengthening action in advance, the multilayer chip gains enhanced bending resistance that protects it during subsequent handling, assembly, and operation, preventing damage before it can occur.
Solution Approach 2:
The formation of side gaps on both side surfaces creates a cushioning effect that absorbs and distributes mechanical stresses. This preliminary protective measure cushions the thin multilayer chip against bending forces and mechanical damage that may occur during assembly and operation, reducing the likelihood of failure.
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.