Multi-layer Ceramic Capacitor Side Margin Bonding
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Solution Overview
Problem
The miniaturization of multi-layer ceramic capacitors poses challenges in properly punching ceramic sheets using the side surfaces of multi-layer units, as the reduced dimensions lead to insufficient bonding strength and shear force application.
Innovation Solution
A multi-layer ceramic electronic component configuration with a multi-layer unit having a first dimension of 0.5 mm or less and a side surface area of 0.1 mm2 or more, allowing for high bonding strength and sufficient shear force application to punch ceramic sheets effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the multi-layer unit is miniaturized to reduce the size of the multi-layer ceramic capacitor, then the capacitance density increases, but the bonding strength between the side margin and the multi-layer unit decreases
Solution Approach 1:
The patent applies local quality by maintaining a sufficient side surface area (0.1 mm² or more) specifically at the punching location, while allowing other dimensions of the multi-layer unit to be miniaturized. This localized preservation of surface area ensures adequate bonding strength at the critical interface between the side margin and multi-layer unit, without preventing overall miniaturization of the capacitor.
2Volume of moving object
If the multi-layer unit is miniaturized, then the capacitance density increases, but the shear force application capability during punching decreases
Solution Approach 1:
The patent ensures that the side surface area used for punching remains sufficiently large (0.1 mm² or more), creating a localized region with adequate force transmission capability. This allows the multi-layer unit to be miniaturized overall while maintaining sufficient shear force application capability at the critical punching interface.
3Strength
If the side surface area is increased to improve bonding strength, then the bonding strength increases, but the size of the multi-layer unit increases
Solution Approach 1:
The patent applies local quality by concentrating the necessary surface area (0.1 mm² or more) specifically at the side surface used for punching and side margin formation, while allowing other dimensions of the multi-layer unit to be minimized. This localized approach ensures adequate bonding strength without requiring an overall increase in the size of the multi-layer unit.
Data Source
AI summary
A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a direction of a first axis, internal electrodes positioned between the ceramic layers, and a side surface facing in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the side surface, the multi-layer unit having a first dimension of 0.5 mm or less along a direction of a third axis orthogonal to the first axis and the second axis, the side surface having an area of 0.1 mm2 or more. The side margin covers the side surface of the multi-layer unit.