MLCC Side Margin Composition for Moisture and Breakdown Resistance
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Solution Overview
Problem
Existing multilayer ceramic capacitors face issues with reduced lifespan and reliability due to moisture permeation, electric field concentration, and decreased bonding strength at the boundary surface between the body and side margin portion, which are exacerbated by pores and reduced thickness, leading to decreased breakdown voltage and moisture resistance.
Innovation Solution
A multilayer electronic component design with specific Ba/Ti molar ratios and controlled compositions of Mg and Sn in the side margin portions, ensuring higher Ba/Ti ratios and adjusted grain sizes to enhance moisture resistance and withstand voltage properties, thereby improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If side margin portion is formed by separately attaching ceramic green sheets to maximize electrode area, then capacitance per unit volume is improved, but pores are created on the boundary surface causing moisture permeation and reduced reliability
Solution Approach 1:
The patent changes the chemical composition parameters of the side margin portion by adding specific amounts of Mg (0.5-2.0 wt%), Sn (0.1-5.0 wt%), and adjusting the Ba/Ti molar ratio (1.025-1.035). These parameter changes promote grain growth and densification during sintering, reducing porosity on the boundary surface and improving moisture resistance while maintaining high capacitance per unit volume.
2Productivity
If side margin portion is formed to maximize electrode area, then effective volume fraction is increased, but bonding strength at the boundary surface decreases due to pores
Solution Approach 1:
The patent modifies the chemical composition of the side margin portion by adding Mg and Sn oxides and adjusting the Ba/Ti molar ratio. These compositional changes facilitate grain growth and densification during the sintering process, reducing porosity at the boundary surface and thereby improving bonding strength between the side margin portion and the main body while maintaining high effective volume fraction.
3Length of moving object
If thickness is reduced to achieve miniaturization, then device size is decreased, but electric field concentration occurs in the dielectric layer reducing breakdown voltage
Solution Approach 1:
The patent applies local quality by creating a side margin portion with different chemical composition than the main body. The side margin portion has higher Ba/Ti molar ratio and contains Mg and Sn additives, which promote grain growth and densification specifically at the boundary regions. This local compositional differentiation reduces porosity and strengthens the dielectric layer at critical locations, improving breakdown voltage while maintaining overall miniaturization.
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.