Multi-Layer Ceramic Capacitor Side Margin Formation

Solution Overview

Problem

The challenge in producing multi-layer ceramic capacitors is the difficulty in forming uniform side margins, which can lead to insulation issues and short circuits between internal electrodes due to the drag of electrodes during cutting, especially when using blades like push-cutting or rotary blades.

Innovation Solution

A method involving the removal of the superficial layer of the side surface of the multi-layer chip after cutting, followed by the application of side margins, using techniques such as grinding, blasting, or laser irradiation to prevent short circuits, ensuring uniformity and insulation properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If side margins are made thinner to enlarge internal electrodes, then the capacity and miniaturization are improved, but the insulation properties of the periphery of the internal electrodes deteriorate

Engineering Contradiction:

ImprovecapacityVSAvoidinsulation properties

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent applies preliminary action by providing side margins in a subsequent step after cutting the multi-layer sheet. This means the side margins are not formed during the initial cutting process but are added later to ensure proper insulation. The side margins are provided to the side surfaces of the multi-layer chip after cutting, which prevents short circuits between internal electrodes while allowing the side margins to be made thinner for miniaturization and increased capacity.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If conventional cutting methods are used to cut the multi-layer sheet, then the productivity is improved, but the internal electrodes may be dragged and elongated causing short circuits

Engineering Contradiction:

Improvecutting efficiencyVSAvoidshort circuit prevention

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies preliminary action by providing side margins in a subsequent step after cutting the multi-layer sheet. This means the side margins are not formed during the initial cutting process but are added later to ensure proper insulation. The side margins are provided to the side surfaces of the multi-layer chip after cutting, which prevents short circuits between internal electrodes while allowing the side margins to be made thinner for miniaturization and increased capacity.

Inventive Principle:

Principle #10Preliminary action

3Volume of moving object

If side margins are made thinner to achieve miniaturization, then the size is reduced, but the uniformity of side margin thickness becomes more difficult to ensure

Engineering Contradiction:

ImprovesizeVSAvoiduniformity of side margin thickness

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by providing side margins in a subsequent step after cutting the multi-layer sheet. This means the side margins are not formed during the initial cutting process but are added later to ensure proper insulation. The side margins are provided to the side surfaces of the multi-layer chip after cutting, which prevents short circuits between internal electrodes while allowing the side margins to be made thinner for miniaturization and increased capacity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively prevents short circuits between internal electrodes, allowing for the production of multi-layer ceramic capacitors with designed performance by ensuring uniform side margins and insulation properties.

Implementation Method 1

removing a superficial layer of the side surface of the multi-layer chip; the side surface of the multi-layer chip may be grinder to remove the superficial layer

Methodology Applied

Scientific EffectGrinding: Abrasion

Implementation Method 2

The side surface of the multi-layer chip may be irradiated with laser to remove the superficial layer

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 3

The side surface of the multi-layer chip may be subjected to blasting to remove the superficial layer

Methodology Applied

Scientific EffectBlasting: Abrasion

Data Source

PatentUS10510487B2Multi-layer ceramic electronic component and method of producing the same

Publication Date: 2019.12.17 TAIYO YUDEN KK

AI summary

A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce a multi-layer chip having a side surface from which the internal electrodes are exposed; removing a superficial layer of the side surface of the multi-layer chip; and providing a side margin to the side surface of the multi-layer chip, the superficial layer being removed from the side surface.