Multilayer Ceramic Capacitor Side Margin Structure for Gap Prevention
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Solution Overview
Problem
The existing manufacturing process for multilayer ceramic capacitors faces challenges in achieving a strong bond between the side margin portions and the body, leading to potential gaps due to foreign substances and differences in contraction rates during sintering.
Innovation Solution
The proposed solution involves a multilayer electronic component design where the side margin portions include inner and outer margin portions. The inner margin portions cover at least a portion of the active portion on the surfaces, while the outer margin portions are in contact with the upper and lower cover portions, enhancing the bonding force between the side margin portions and the body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a side margin portion is separately attached to maximize electrode effective area, then miniaturization and high capacitance are achieved, but gaps may form between the side margin portion and body due to foreign substances and contraction rate differences
Solution Approach 1:
The side margin portion is divided into two distinct segments: an inner margin portion that contacts the active portion and an outer margin portion that contacts the cover portions. This segmentation allows each segment to perform its specific bonding function, with the inner margin portion addressing bonding to the active portion and the outer margin portion addressing bonding to the cover portions, thereby resolving the bonding reliability issue while maintaining electrode effective area
Solution Approach 2:
The inner margin portion acts as an intermediary element between the active portion and the outer margin portion. It provides a bonding interface that compensates for contraction rate differences and prevents gap formation, while the outer margin portion serves as an intermediary between the side margin portion and the cover portions, ensuring stable bonding throughout the sintering process
2Quantity of substance
If marginless design is used to maximize internal electrode area, then capacitance increases, but bonding reliability deteriorates due to lack of margin portions
Solution Approach 1:
Instead of applying a uniform margin design throughout the component, the invention applies margin portions only where needed - specifically at the side surfaces where bonding is required. The inner and outer margin portions are strategically positioned to provide local bonding reinforcement without reducing the overall electrode effective area, thus maintaining high capacitance while improving bonding reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively improves the bonding force between the side margin portions and the body, thereby preventing gaps from widening, which enhances the reliability and performance of the multilayer ceramic capacitors.
Implementation Method 1
during a plasticizing and/or sintering operation
Data Source
AI summary
A multilayer electronic component may include: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other; first and second side margin portions disposed on the fifth and sixth surfaces, respectively; and first and second external electrodes disposed on the third and fourth surfaces, respectively. The body may include an active portion including an internal electrode alternately disposed with the dielectric layer, upper and lower cover portions disposed above and below the active portion in the first direction, respectively. One of the first and second side margin portions may include an inner margin portion covering at least a portion of the active portion, and an outer margin portion disposed on the inner margin portion and being in contact with the upper and lower cover portions.