Multilayer Ceramic Capacitor Side Margin Geometry for Moisture Resistance

The patent changes the temperature parameter during the punching process by introducing a cooling mechanism. The sheet is cooled to a temperature below its glass transition temperature before punching, which prevents stretching and deformation during the process. This parameter change resolves the contradiction by enabling easy manufacturing through punching while maintaining the sheet's physical properties and preventing detachment, thus ensuring moisture resistance reliability.

Instead of heating the sheet to make it pliable for attachment, the patent inverts the approach by cooling the sheet to below its glass transition temperature. This makes the sheet rigid and dimensionally stable during punching, eliminating the need for subsequent drying and curing processes. The inversion of temperature application resolves the contradiction by enabling easy sheet formation through cooling rather than heating, significantly reducing processing time.

The patent applies preliminary cooling action to the sheet before the punching process. By cooling the sheet to below its glass transition temperature in advance, the material becomes rigid and maintains its shape during punching. This preliminary action prevents uneven fracture surfaces and ensures uniform, clean edges. The cooling step is performed before punching, which resolves the contradiction by enabling efficient attachment while achieving high manufacturing precision in the fracture surface uniformity.