Multilayer Ceramic Capacitor Side Margin Metal Content

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in achieving high moisture resistance reliability and internal electrode connectivity while maintaining high capacitance and miniaturization, as the addition of side margin portions can compromise the dielectric layer and lead to reduced thickness, affecting the capacitor's performance.

Innovation Solution

A multilayer electronic component design with side margin portions containing more metal than the dielectric layers, where a metal oxide is added to the ceramic green sheet for the side margin portion to prevent metal leakage during sintering and enhance moisture resistance, and a manufacturing method involving the lamination of ceramic green sheets with internal electrode patterns, cutting to expose electrode ends, attaching a ceramic green sheet for the side margin, sintering, and heat-treating in a reducing atmosphere.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If side margin portions are separately attached to maximize electrode effective area, then capacity per unit volume is improved, but moisture resistance reliability deteriorates due to decreased thickness of side margin portions

Engineering Contradiction:
Improvecapacity per unit volumeVSAvoidmoisture resistance reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies different metal content concentrations to different regions: the side margin portions have a first metal content concentration while the active portion dielectric layer has a second metal content concentration. This local differentiation allows the side margin to have enhanced moisture resistance through higher metal content without compromising the capacitance performance of the active portion.

Inventive Principle:
Principle #3Local quality

2Reliability

If margin dielectric sheet additive is increased to suppress grain growth and prevent moisture penetration, then moisture resistance is improved, but chip characteristics change due to additive diffusion into the dielectric layer of the active portion

Engineering Contradiction:
Improvemoisture resistanceVSAvoidchip characteristics
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent implements spatially differentiated metal content by setting the side margin portions to have a first metal content concentration that is higher than the second metal content concentration in the active portion dielectric layer. This localized enhancement prevents moisture penetration at the margins while avoiding additive diffusion issues in the active portion.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the dielectric structure into two distinct regions with different metal content concentrations: side margin portions and active portion dielectric layer. This segmentation allows independent optimization of each region's properties - moisture resistance at margins and electrical performance in the active portion.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves moisture resistance reliability and internal electrode connectivity, maintaining high capacitance and miniaturization, while the manufacturing method ensures effective metal distribution and reduced risk of short circuits, enhancing the overall performance of the multilayer ceramic capacitors.

Implementation Method 1

a method of suppressing the penetration of moisture through the grain boundaries of the margin portion by densifying grains in the margin portion by suppressing grain growth by changing the composition of the margin dielectric sheet

Methodology Applied
Scientific EffectGrain growth suppression:

Implementation Method 2

heat-treating in a reducing atmosphere

Methodology Applied
Scientific EffectHeat treatment in reducing atmosphere: Heat Treatment

Data Source

PatentUS11574774B2Multilayer electronic component and method of manufacturing the same
Publication Date: 2023.02.07 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11574774B2 patent drawing
  • US11574774B2 patent drawing
  • US11574774B2 patent drawing

AI summary

A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.