Multilayer Ceramic Capacitor Side Margin Mg/Ti Ratio
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Solution Overview
Problem
As electronic components, such as multilayer ceramic capacitors, are miniaturized, the reduction in dielectric layer thickness leads to degraded insulation resistance, compromising reliability.
Innovation Solution
The electronic component design includes a laminate structure with internal electrodes and dielectric layers alternately laminated, where the dielectric layers and side margin portions contain Ti and Mg, with a specific molar ratio of Mg to Ti, and the internal electrodes have a segregated Mg portion near the end, reducing the thickness and improving insulation resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic component is reduced in size, then the size of the component is reduced, but the insulation resistance between internal electrodes is degraded
Solution Approach 1:
The patent applies local quality by creating side margin portions with a different Mg/Ti molar ratio (smaller than 0.05) compared to the main dielectric layers (Mg/Ti molar ratio of 0.05 or more). This local compositional difference enhances insulation resistance specifically in regions where internal electrodes are present, preventing short circuits while allowing overall component miniaturization.
Solution Approach 2:
The patent changes the chemical composition parameters of the dielectric material by controlling the Mg/Ti molar ratio in different regions. The side margin portions have a lower Mg/Ti ratio (less than 0.05) compared to the bulk dielectric layers, which creates a compositional gradient that improves insulation properties without compromising capacitance, thereby enabling smaller component sizes with maintained reliability.
2Length of stationary object
If the thickness of dielectric layers is reduced, then the size of the component is reduced, but the insulation resistance between internal electrodes is degraded
Solution Approach 1:
The patent implements local quality by forming side margin portions with distinct compositional characteristics (lower Mg/Ti ratio) at the edges of the dielectric layers. This localized compositional modification provides enhanced insulation performance at critical regions where thin dielectric layers are present, preventing short circuits between adjacent internal electrodes even when the overall dielectric thickness is reduced for miniaturization.
Solution Approach 2:
The patent effectively creates a composite dielectric structure consisting of two distinct regions: main dielectric layers with higher Mg/Ti ratio (0.05 or more) providing capacitance, and side margin portions with lower Mg/Ti ratio (less than 0.05) providing enhanced insulation. This composite approach allows the thin dielectric layers to maintain both electrical performance and insulation reliability.
Data Source
AI summary
An electronic component includes a laminate including internal electrodes alternately laminated in a lamination direction with dielectric layers interposed therebetween. The laminate includes main surfaces opposite to each other in the lamination direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction, and external electrodes provided on surfaces of the laminate and electrically connected to the internal electrodes. Each of the dielectric layers includes Ti and Mg. When a cross section including the length direction and the width direction of the laminate is viewed from the lamination direction, side margin portions in which the internal electrodes do not exist each include a dielectric including Ti and Mg with a molar ratio in each of the side margin portions smaller than a molar ratio of Mg to Ti included in each of the dielectric layers.