Multilayer Ceramic Capacitor Side Margin Extension Design
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with reduced breakdown voltage and moisture resistance reliability due to external moisture penetration and pore formation at the interface between the body and side margin portions, leading to defects and shortened lifespan.
Innovation Solution
The multilayer electronic component features extended side margin portions that cover the body to prevent moisture and plating solution penetration, with specific extension portions designed to extend onto the surfaces, improving the interface structure and reducing pore occurrence, thereby enhancing moisture resistance reliability and breakdown voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a ceramic green sheet for a side margin portion is separately attached to maximize electrode area, then capacitance per unit volume is improved, but penetration of external moisture or plating solution through the interface joint portion causes shortening of chip lifespan and defects
Solution Approach 1:
The side margin portion is divided into a body region and an extension portion that protrudes from the body surface. This segmentation allows the extension portion to specifically cover the interface joint portion between the internal electrode and the body, creating a protective barrier against moisture and plating solution penetration while maintaining the capacitance-enhancing side margin structure.
2Quantity of substance
If a ceramic green sheet for a side margin portion is separately attached to maximize electrode area, then capacitance per unit volume is improved, but occurrence of defects and shortening of chip lifespan occur
Solution Approach 1:
The side margin portion is divided into a body region and an extension portion that protrudes from the body surface. This segmentation allows the extension portion to specifically cover the interface joint portion between the internal electrode and the body, creating a protective barrier against moisture and plating solution penetration while maintaining the capacitance-enhancing side margin structure.
3Shape
If pores are created at the interface between the body and side margin portion, then the structure is formed, but concentration of electrical field causes decrease in breakdown voltage and decrease in sintering density causes decrease in moisture resistance reliability
Solution Approach 1:
The extension portion of the side margin is designed to protrude from the body surface before sintering, covering the interface joint portion in advance. This preliminary protective structure prevents pore formation at the interface during the sintering process, thereby preventing electrical field concentration and maintaining high breakdown voltage and moisture resistance reliability.
4Shape
If an interface joint portion occurs on the boundary between the body and side margin portion, then the structure is formed, but decrease in bonding strength causes decrease in moisture resistance reliability
Solution Approach 1:
The side margin portion is divided into a body region and an extension portion that protrudes from the body surface. This segmentation allows the extension portion to specifically cover the interface joint portion between the internal electrode and the body, creating a protective barrier against moisture and plating solution penetration while maintaining the capacitance-enhancing side margin structure.
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface, connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface, connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the third and fourth surfaces; and a first side margin portion and a second side margin portion, respectively disposed on the fifth and sixth surfaces, wherein the first and second side margin portions include a first extension portion disposed to extend onto a portion of the first surface and a portion of the second surface.