Multilayer Ceramic Capacitor Side Member Geometry for Carbon Removal

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Solution Overview

Problem

The existing manufacturing methods for multilayer ceramic capacitors result in thicker margin portions at the edges, making it difficult to remove carbon residues and increasing the risk of chip breakage during polishing, which affects the capacitor's reliability and capacity.

Innovation Solution

The solution involves forming side members on the multilayer ceramic capacitor using ceramic slurry to cover the distal edges of the inner electrodes, with an angle less than 90° between the virtual line connecting the inner electrodes and the side members, and controlling the thickness of these side members to be 30 μm or less, which allows for easier removal of carbon residues and enhances the capacitor's reliability and capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the multilayer ceramic capacitor is manufactured using conventional methods with thicker margin portions at edges, then the structural strength is improved, but carbon removal becomes difficult and chip breakage risk increases

Engineering Contradiction:
Improvestructural strengthVSAvoidcarbon removal difficulty and chip breakage risk
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent applies local quality by forming side members with specific geometric characteristics (angle less than 90° and thickness 30 μm or less) only at the margin portions of the multilayer body, while the central portions maintain conventional thickness. This localized modification enables easier carbon removal and reduced breakage risk at edges without compromising the overall structural strength of the capacitor.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the geometric parameters of the margin portions by controlling the angle between the side member and the virtual line connecting distal edges to be less than 90° (specifically 5° to 85°), and limiting the thickness to 30 μm or less. These parameter changes facilitate carbon removal during firing and reduce stress concentration, thereby preventing chip breakage while maintaining structural integrity.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the margin portions are made thinner to facilitate carbon removal, then carbon removal becomes easier, but the structural strength and moisture resistance may be compromised

Engineering Contradiction:
Improvecarbon removal easeVSAvoidstructural strength and moisture resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The side members are formed only at the margin portions of the multilayer body, leaving the central portions with conventional thickness. This localized thinning approach enables easier carbon removal at edges where it is most needed, while the thicker central portions maintain the overall structural strength and moisture resistance of the capacitor.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent creates an asymmetric structure where the margin portions have different geometric characteristics (angle less than 90°, thickness ≤30 μm) compared to the central portions. This asymmetry optimizes carbon removal at the edges while preserving the structural integrity provided by the thicker central regions.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS9123472B2High capacity multilayer ceramic capacitor and method of manufacturing the same
Publication Date: 2015.09.01 SAMSUNG ELECTRO MECHANICS CO LTD
  • US9123472B2 patent drawing
  • US9123472B2 patent drawing
  • US9123472B2 patent drawing

AI summary

There is disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposite to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed in the multilayer body and having distal edges exposed to the first side or the second side, first and second side members formed on the first and second sides to cover the distal edges of the plurality of inner electrodes, and outer electrodes formed on the third side and the fourth side to be electrically connected to the inner electrodes. An angle between a virtual line connecting the distal edges of the plurality of inner electrodes and the first side member or the second side member is less than 90° (π/2).