Multilayer Ceramic Capacitor Side Surface Smoothing
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Solution Overview
Problem
Existing methods for manufacturing multilayer ceramic capacitors face challenges in achieving a smooth and clean side surface, with issues such as foreign substances, deformation of ceramic dielectric sheets, and stress-induced distortions during cutting, leading to unreliable capacitors with potential electric field concentration.
Innovation Solution
A method involving printing internal electrode patterns, forming dielectric patterns, laminating dielectric layers, exposing internal electrodes, removing excess dielectric material, and forming a dielectric gap layer on the side surface to create a smooth and clean state, using different compositions for dielectric ceramic layers to optimize reliability and reduce electric field concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a ceramic dielectric sheet is laminated on a cut surface of a multilayer body, then the side surface can be formed, but the cut surface may not be sufficiently smooth or may contain foreign substances, causing the ceramic dielectric sheet to deform during lamination
Solution Approach 1:
The patent applies preliminary polishing treatment to the cut surface of the multilayer body before laminating the ceramic dielectric sheet. This preliminary action removes surface irregularities and foreign substances, ensuring a smooth base surface that prevents deformation of the ceramic dielectric sheet during subsequent lamination processes
Solution Approach 2:
The patent introduces a ceramic paste layer as an intermediary substance between the cut surface and the ceramic dielectric sheet. This intermediate layer compensates for any remaining surface imperfections and provides a uniform bonding interface, preventing direct transmission of surface defects to the ceramic dielectric sheet
2Quantity of substance
If the thickness of the side margin is reduced to increase internal electrode area, then capacitance increases, but the side surface becomes more susceptible to deformation and contamination
Solution Approach 1:
The patent optimizes the thickness parameter of the ceramic dielectric sheet and the composition parameters of the ceramic paste to achieve the desired balance. By carefully controlling these parameters, the patent enables reduced side margin thickness while maintaining sufficient structural integrity and preventing deformation
Solution Approach 2:
The patent uses composite ceramic materials with specific compositions that provide both the mechanical strength needed for thin side margins and the electrical properties required for high capacitance. The composite nature of the ceramic paste and dielectric sheet materials allows simultaneous optimization of structural and electrical performance
3Productivity
If cutting is performed to obtain multiple multilayer bodies, then productivity increases, but stress during cutting causes ceramic dielectric sheets to move and deform
Solution Approach 1:
The patent applies preliminary reinforcement or support structures to the ceramic dielectric sheets before cutting. This preliminary action prevents sheet movement and deformation during the cutting process, maintaining positioning accuracy even when producing multiple multilayer bodies efficiently
Solution Approach 2:
The patent replaces traditional mechanical cutting methods that cause stress and deformation with alternative cutting techniques such as laser cutting or waterjet cutting. These substituted methods reduce mechanical stress on the ceramic dielectric sheets, preventing internal electrode displacement while maintaining high productivity
Data Source
AI summary
A method of manufacturing a multilayer ceramic capacitor includes printing an internal electrode pattern on a dielectric layer, forming a dielectric pattern in a region other than a region in which the internal electrode pattern is printed, laminating dielectric layers to form a multilayer body, exposing the internal electrode pattern and the dielectric pattern from a side surface of the multilayer body, removing at least a portion of the exposed dielectric pattern, and forming a dielectric gap layer on the side surface.