MLCC Silicon Coating Structure for Moisture and Bending Resistance

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in achieving high bending strength and humidity resistance reliability, particularly in automotive applications where they are subjected to stricter conditions and increased demand for miniaturization and high capacitance.

Innovation Solution

A multilayer electronic component design featuring a body with alternately stacked dielectric and internal electrodes, external electrodes with conductive resin layers, and a silicon organic compound layer that covers external surfaces and extends between electrode and conductive resin layers to enhance mechanical strength and humidity resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a double-layer structure including electrode layer and conductive resin layer is used, then reliability is improved by absorbing external impacts and preventing plating liquid permeation, but bending strength and humidity resistance reliability are insufficient for automotive applications

Engineering Contradiction:
Improveimpact resistanceVSAvoidbending strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining the conductive resin layer with a silicon-based organic compound layer having hydrophobic properties. This composite structure not only absorbs external impacts but also significantly improves bending strength and humidity resistance, meeting automotive application requirements while maintaining the protective functions against plating liquid permeation

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the chemical and physical parameters of the protective layer by using a silicon-based organic compound with hydrophobic characteristics. This parameter change enhances the layer's ability to resist humidity and improve bending strength while maintaining its impact absorption capability, thereby resolving the contradiction between reliability and strength

Inventive Principle:
Principle #35Parameter changes

2Volume of moving object

If miniaturization and high capacitance are pursued, then device size is reduced and capacitance is increased, but bending strength and humidity resistance characteristics deteriorate

Engineering Contradiction:
Improvecomponent sizeVSAvoidbending strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent uses composite materials in the protective layer structure to compensate for the reduced mechanical strength resulting from miniaturization. The silicon-based organic compound layer provides enhanced bending strength and humidity resistance even as the component size is reduced, allowing the device to achieve both miniaturization and high capacitance while maintaining adequate strength characteristics

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If conventional electrode structure is used, then manufacturing is simpler, but humidity resistance reliability is insufficient for automotive applications

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidhumidity resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the chemical parameters of the protective layer by introducing a silicon-based organic compound with hydrophobic properties. This modification significantly improves humidity resistance reliability for automotive applications while maintaining a manufacturing process that is relatively simple and compatible with existing production methods

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly improves bending strength and humidity resistance reliability, while maintaining low equivalent series resistance (ESR), effectively addressing the stringent requirements of automotive applications.

Implementation Method 1

a silicon organic compound layer having a body cover portion disposed on a region of external surfaces of the body between the first and second electrode layers

Methodology Applied
Scientific EffectHydrophobicity: Hydrophobe

Data Source

PatentUS11862404B2Multilayer electronic component for enhanced moisture resistance and bending strength
Publication Date: 2024.01.02 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11862404B2 patent drawing
  • US11862404B2 patent drawing
  • US11862404B2 patent drawing

AI summary

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.