Multilayer Ceramic Capacitor Sn Plating for Solder-Free Mounting
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Solution Overview
Problem
The challenge is to maximize space utilization on a substrate for multilayer ceramic capacitors in miniaturized electronic devices while achieving high capacity, without using solder for mounting, as traditional solder-based methods occupy additional space and limit thickness reduction.
Innovation Solution
A multilayer electronic component design featuring a body with alternately disposed dielectric and internal electrodes, and external electrodes with a Sn plating layer, where the thickness of the body is 0.22 mm or less and the Sn plating layer is 4.5 μm or more, allowing for solder-free mounting by ensuring sufficient adhesion strength and reduced volume in the thickness direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder is used for mounting the multilayer electronic component, then adhesion strength is improved, but space utilization on the substrate deteriorates due to additional space occupation
Solution Approach 1:
The patent extracts and eliminates the solder from the mounting system, replacing it with a direct bonding interface between the Sn plating layer on the external electrode and the electrode pad on the substrate. This removal of the intermediate solder material reduces the overall space occupation while maintaining adhesion through the optimized Sn plating layer with thickness of 4.5 μm or more.
Solution Approach 2:
The patent changes the thickness parameter of the Sn plating layer to 4.5 μm or more, which is thicker than conventional plating. This parameter change ensures sufficient adhesion strength without requiring additional solder, thereby achieving both strong bonding and improved space utilization on the substrate.
2Area of stationary object
If the body thickness is reduced to maximize space utilization, then space utilization is improved, but adhesion strength may deteriorate
Solution Approach 1:
The patent optimizes two parameters simultaneously: body thickness is reduced to 0.22 mm or less for improved space utilization, while the Sn plating layer thickness is increased to 4.5 μm or more to maintain adhesion strength. This dual parameter optimization resolves the contradiction between miniaturization and bonding reliability.
Solution Approach 2:
The patent employs a composite structure consisting of the ceramic body with reduced thickness and a thick Sn plating layer. This composite configuration allows the thin body to provide compactness while the thick Sn plating layer provides the necessary mechanical strength and adhesion for mounting without solder.
3Ease of operation
If the Sn plating layer thickness is increased to enable solder-free mounting, then ease of operation is improved, but volume of the component increases
Solution Approach 1:
The patent carefully controls the Sn plating layer thickness parameter to be 4.5 μm or more, which is sufficient to enable solder-free mounting through direct bonding to the electrode pad. This optimized thickness provides the necessary adhesion strength while minimizing the volume increase compared to thinner plating configurations.
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 μm or more.