Multilayer Ceramic Component Solder Prevention via Conductive Thin Films
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in achieving high capacitance while maintaining a small size, and existing solutions struggle to prevent solder attachment to the components' end surfaces during mounting on a substrate, which affects integration density and reliability.
Innovation Solution
A multilayer ceramic electronic component design featuring a ceramic body with stacked dielectric layers, internal and external electrodes, conductive thin films on specific surfaces, and solder preventing films on the external electrodes to prevent solder attachment and increase capacitance, allowing for higher integration density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of dielectric layers is decreased and the number of stacked dielectric layers is increased to achieve high capacitance and small size, then capacitance increases and component size decreases, but the external electrodes become thinner and more vulnerable to solder attachment on end surfaces
Solution Approach 1:
The external electrode structure is segmented into multiple functional layers: a base external electrode layer and an additional conductive thin film layer. This segmentation allows the conductive thin film to specifically prevent solder attachment while the base electrode maintains electrical connection, resolving the contradiction between thin electrode design and solder protection.
Solution Approach 2:
A conductive thin film is introduced as an intermediary layer between the external electrode and the solder. This thin film acts as a barrier that prevents solder from attaching to the end surfaces while maintaining electrical conductivity, solving the problem of solder attachment on thin external electrodes.
2Area of stationary object
If the area required for mounting the component on a substrate is decreased to increase integration density, then integration density increases, but solder attachment to end surfaces becomes more problematic
Solution Approach 1:
The conductive thin film is applied in advance to the external electrode before the soldering process. This preliminary action creates a protective barrier that prevents solder from attaching to the end surfaces, allowing for compact mounting arrangements without solder attachment problems.
Solution Approach 2:
The conductive thin film is selectively applied to specific regions of the external electrode, particularly the end surfaces that are prone to solder attachment. This localized treatment provides solder protection exactly where needed without affecting the overall mounting area or electrical performance.
3Length of stationary object
If the thickness of external electrodes is decreased to enable compact design, then component size decreases, but the ability to prevent solder attachment is reduced
Solution Approach 1:
The external electrode system uses a composite structure combining a base electrode material (such as metal paste) with a conductive thin film material. This composite approach allows the thin base electrode to gain enhanced solder resistance from the conductive thin film layer, achieving both compact size and reliable solder protection.
Solution Approach 2:
The conductive thin film serves as an intermediary protective layer that compensates for the reduced thickness of the base external electrode. It provides the necessary solder attachment prevention capability that would be difficult to achieve with a thin base electrode alone.
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body including a plurality of dielectric layers stacked on each other and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, parallel to a stacking direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces, first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, first and second conductive thin films disposed on at least one of the third and fourth surfaces, connected to the first and second external electrodes, respectively, and having a thickness lower than that of the first and second external electrodes, and first and second solder preventing films disposed on the first and second external electrodes, respectively.