Multilayer Ceramic Capacitor Solid-Dissolved Interface
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Solution Overview
Problem
The reduction in thickness of dielectric and inner electrode layers in multilayer ceramic capacitors leads to electric field concentration at dielectric coupling portions, resulting in decreased reliability and life expectancy due to short-circuit failures and reduced insulation properties.
Innovation Solution
Incorporating a solid-dissolved layer with a secondary metal, such as Sn, at the interface between the dielectric coupling portions and the inner electrode layers, with a concentration of 0.1 mol% to 10 mol% of Sn in 100 mol of the main component metal, to reduce electric field concentration and enhance insulation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the dielectric layer and inner electrode layer is reduced to achieve further miniaturization and larger capacitance, then the capacitance density increases, but electric field concentration occurs at dielectric coupling portions leading to decreased reliability and life expectancy
Solution Approach 1:
The invention introduces a solid-dissolved layer with a specific metal composition at the critical interface between the dielectric coupling portion and inner electrode layer. This localized modification of material properties at the electric field concentration point prevents short-circuit failures without affecting the overall miniaturization and capacitance density of the capacitor.
Solution Approach 2:
The solid-dissolved layer acts as an intermediary layer between the dielectric coupling portion and inner electrode layer. This intermediate layer with controlled metal content (0.1-10 mol%) serves as a buffer that mitigates the harmful electric field concentration effect, preventing direct contact and potential short-circuiting while maintaining the reduced thickness design.
2Quantity of substance
If the thickness of the inner electrode layer is reduced and multiple through holes are formed, then the capacitance increases, but the dielectric coupling portions cause electric field concentration that reduces insulation properties
Solution Approach 1:
The solid-dissolved layer is specifically positioned at the interface surrounding the dielectric coupling portions where electric field concentration occurs. By locally modifying the material composition at these critical points with 0.1-10 mol% metal content, the invention addresses the electric field concentration issue without changing the overall capacitor structure or reducing capacitance.
Solution Approach 2:
The invention converts the potentially harmful effect of electric field concentration at dielectric coupling portions into a beneficial outcome. By introducing the solid-dissolved layer with controlled metal content, the concentrated electric field is redistributed and controlled, preventing insulation breakdown while maintaining the through-hole structure that enables high capacitance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces or prevents the decrease in reliability and life expectancy of multilayer ceramic capacitors by improving insulation properties and minimizing electric field concentration at dielectric coupling portions, thereby enhancing the capacitors' performance and durability.
Implementation Method 1
concentration of an electric field occurs in a dielectric coupling portion in an inner electrode layer
Implementation Method 2
a solid-dissolved layer, in which a second metal different from the first metal is solid-dissolved
Data Source
AI summary
A multilayer ceramic capacitor includes dielectric layers made of a ceramic material and inner electrode layers that are laminated. Each of the inner electrode layers includes a first metal as a main component, and dielectric coupling portions penetrating through in a lamination direction, filled with a portion of adjacent dielectric layers, and coupling the adjacent dielectric layers to each other. A solid-dissolved layer, in which a second metal different from the first metal is solid-dissolved, is provided at an interface between the dielectric coupling portions and the inner electrode layers. A content of the second metal in the solid-dissolved layer is about 0.1 mol % or more and about 10 mol % or less in 100 mol of the first metal.