Multilayer Ceramic Capacitor Spacer Geometry for Quiet Reliable Mounting

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in reliable mounting on circuit boards and in reducing acoustic noise due to spacer shape and solder spread, which can cause vibration propagation.

Innovation Solution

The capacitors are designed with spacers angled at 5 degrees or less relative to the multilayer body surface, and a specific shape and material configuration to ensure secure bonding and minimize solder spread, using intermetallic compounds and phenol resin to enhance mechanical strength and bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If spacers are provided on the multilayer body to reduce acoustic noise, then acoustic noise is reduced, but mounting reliability deteriorates due to difficulty in mounting on circuit board

Engineering Contradiction:
Improveacoustic noiseVSAvoidmounting reliability
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent changes the geometric parameters of the spacer, specifically setting the angle between the second main surface of the spacer and the main surface of the multilayer body to 5 degrees or less. This parameter optimization reduces the gap between the spacer and the circuit board land, improving mounting reliability while maintaining the acoustic noise reduction function.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If spacers with certain shapes are used to reduce acoustic noise, then acoustic noise is reduced, but solder spread increases causing vibration propagation

Engineering Contradiction:
Improveacoustic noiseVSAvoidvibration propagation
Core Design Contradiction:
Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The patent optimizes the spacer geometry by controlling the angle of the second main surface to be 5 degrees or less relative to the multilayer body surface. This geometric parameter change prevents solder from spreading up the spacer surface, thereby eliminating vibration propagation to the circuit board while maintaining acoustic noise reduction.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20260011504A1Multilayer ceramic electronic component
Publication Date: 2026.01.08 MURATA MFG CO LTD
  • US20260011504A1 patent drawing
  • US20260011504A1 patent drawing
  • US20260011504A1 patent drawing

AI summary

A multilayer ceramic electronic component includes a laminate including an inner layer portion including dielectric layers and internal electrode layers, two main surfaces opposing each other in a lamination direction, and two end surfaces opposing each other in a length direction, two external electrodes connected to the internal electrode layers respectively at the two end surfaces and which cover the end surfaces and a portion of the two main surfaces continuous therefrom and opposing each other, and two spacers on one of the two main surfaces sandwiching the external electrodes between the main surface and the two spacers. One of the two surfaces of the spacers opposing each other in the lamination direction and not sandwiching the external electrode has an angle with respect to the main surface of the laminate on which the spacer is located that is about five degrees or less when viewed from the width direction.