MLCC Spacer Recess Structure for Stronger Board Attachment
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Solution Overview
Problem
Multilayer ceramic capacitors with high dielectric constant materials experience significant vibration, which can lead to spacers separating from the mounting board due to weak joining strength.
Innovation Solution
The chip electronic component design includes spacers with recesses on their mounting surface, enhancing the anchoring effect when solder is applied, thereby increasing the fixing strength between the spacers and the mounting board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If spacers are added to reduce vibration transmission, then vibration transmission to mounting board is reduced, but joining strength between spacer and mounting board becomes weak causing spacer separation
Solution Approach 1:
The invention applies curvature to the mounting surface of the spacer by forming recesses (concave portions) in the surface. This curved/non-planar surface structure increases the surface area and creates mechanical interlocking with the solder, thereby enhancing the joining strength between the spacer and mounting board while maintaining the vibration reduction function.
Solution Approach 2:
The mounting surface of the spacer is designed with a porous-like structure through the formation of multiple recesses. This increases the effective surface area for solder attachment and creates anchoring effects that prevent spacer separation, thus improving joining strength without compromising the vibration absorption capability.
2Reliability
If high dielectric constant materials are used in dielectric layers, then capacitance is improved, but vibration amplitude increases causing spacer separation
Solution Approach 1:
By forming recesses in the spacer's mounting surface, the invention creates a curved/non-planar interface that increases mechanical interlocking with the solder. This structural modification compensates for the increased vibration amplitude caused by high dielectric constant materials, preventing spacer separation while maintaining the electrical performance benefits of these materials.
Solution Approach 2:
The invention modifies the physical parameters of the spacer's mounting surface by creating recesses with specific dimensions (depth and width ratios). This structural parameter change enhances the joining strength to withstand the increased vibration forces generated by high dielectric constant materials in the capacitor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents spacers from separating from the mounting board, ensuring stable attachment and reduced vibration transmission, even with high dielectric constant materials.
Implementation Method 1
at least one recess is provided in a surface of one of the spacer principal surfaces that is adjacent to the mounting board
Data Source
AI summary
A chip electronic component includes a multilayer ceramic capacitor and spacers. The multilayer ceramic capacitor includes a multilayer body including inner electrode layers and dielectric layers that are alternately arranged, and outer electrodes. The multilayer body includes capacitor principal surfaces opposite to each other in a lamination direction, capacitor side surfaces opposite to each other in a width direction, and capacitor end surfaces opposite to each other in a length direction. Outer electrodes are provided on respective ones of capacitor end surfaces. The spacers are provided at both ends of one of the capacitor principal surfaces adjacent to a mounting board for the multilayer ceramic capacitor. Each spacer includes spacer principal surfaces opposite to each other in the lamination direction. At least one recess is provided in a surface of one of the spacer principal surfaces adjacent to the mounting board.