MLCC Spacer Geometry to Contain Solder and Reduce Acoustic Noise
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in reliable mounting on circuit boards and effective suppression of acoustic noise due to spacer shape issues and solder spread during heating.
Innovation Solution
The capacitors are designed with spacers on the main surface of the multilayer body, featuring three continuous regions in the width direction with differing shapes, which accommodate excess solder and prevent its spread perpendicular to the mounting surface, thereby reducing acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spacers with simple shapes are used, then manufacturing is easier, but solder spreads along the spacer surface and causes acoustic noise
Solution Approach 1:
The spacer surface is divided into different regions with different shapes: a first region with a substantially flat surface and a second region with an inclined surface. This local variation in surface quality prevents solder from spreading along the spacer while maintaining manufacturing feasibility
Solution Approach 2:
The spacer introduces asymmetric surface geometry with inclined surfaces that create a barrier effect against solder flow. The asymmetric shape configuration prevents solder from wetting up the spacer height, thereby eliminating acoustic noise while remaining manufacturable
2Object-affected harmful factors
If spacers with complex shapes are used, then solder spread is prevented, but mounting reliability decreases
Solution Approach 1:
Only specific portions of the spacer surface are given complex inclined shapes while other portions remain flat. This localized complexity prevents solder spread without compromising the overall mounting reliability of the capacitor on the circuit board
Solution Approach 2:
The spacer surface is segmented into distinct regions (first region with flat surface, second region with inclined surface) that perform different functions: the flat region ensures reliable mounting while the inclined region prevents solder spread
3Ease of operation
If solder is allowed to spread freely, then mounting is simpler, but acoustic noise increases due to inner layer vibration propagation
Solution Approach 1:
The spacer acts as an intermediary structure between the capacitor and the circuit board. Its inclined surface configuration serves as a mechanical barrier that blocks the propagation path of vibrations from the inner layers to the board, thereby reducing acoustic noise while maintaining ease of mounting
Data Source
AI summary
A multilayer ceramic capacitor includes a stack including an inner layer portion including dielectric layers and inner electrode layers alternately stacked, two main surfaces opposing each other in a stacking direction, two end surfaces opposing each other in a length direction, and two side surfaces opposing each other in a width direction, two external electrodes connected to the inner electrode layers on each of the two end surfaces, and covering the end surfaces and portions of the two main surfaces extending therefrom and opposing each other, and two spacers on one of the two main surfaces of the stack with the external electrodes interposed therebetween. The spacers each include first, second, and third regions that are continuous in the width direction, and of which two adjacent regions have different shapes.