Multilayer Ceramic Capacitor Step Structure Corner Design
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with chipping defects and reduced moisture resistance due to corner coverage defects during manufacturing, particularly caused by the wet grinding method which can lead to additional breakage and incomplete evaporation of moisture.
Innovation Solution
The multilayer electronic component incorporates a body with a capacitance-forming portion and cover portions that include a step structure with varying lengths and widths, and higher side surface roughness, which helps in preventing chipping defects and improving moisture resistance by avoiding the need for corner grinding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wet grinding method is used to round corners, then chipping defects are prevented, but additional breakage occurs due to friction impacts and moisture resistance reliability decreases
Solution Approach 1:
The patent applies preliminary action by forming a rounded corner shape during the green sheet stacking process itself, before sintering and before any grinding operation. The green sheets are stacked with overlapping patterns that create rounded corners inherently, so the rounding is built into the structure before manufacturing proceeds, eliminating the need for subsequent grinding that causes breakage and moisture issues
Solution Approach 2:
The patent extracts the corner rounding operation from the manufacturing process entirely. Instead of applying a separate grinding step after sintering, the rounded corner geometry is integrated into the green sheet stacking design phase. This removes the harmful grinding step that causes chip breakage and leaves moisture that degrades reliability
2Manufacturing precision
If corner grinding is performed to prevent chipping, then exterior defects are reduced, but manufacturing complexity increases and additional breakage occurs
Solution Approach 1:
The patent merges the corner rounding function into the green sheet stacking process itself. The overlapping pattern of green sheets naturally forms rounded corners when stacked, combining the structural formation and corner shaping into a single integrated process step, thereby eliminating separate grinding operations and reducing manufacturing complexity
Solution Approach 2:
The rounded corner shape is created in advance during green sheet stacking, before sintering and before any post-processing. The geometry is predetermined and built into the stack configuration, so precision corner coverage is achieved through the stacking design itself rather than through subsequent grinding operations
Data Source
AI summary
A multilayer electronic component includes a body comprising a capacitance-forming portion including a dielectric layer and a plurality of internal electrodes layered with the dielectric layer interposed therebetween, and upper and lower cover portions disposed on upper and lower surfaces of the capacitance-forming portion, respectively; and external electrodes disposed on the body and electrically connected to at least some of the plurality of internal electrodes, respectively, wherein at least one of the upper cover portion and or the lower cover portion has a step structure, and the step structure has a shorter length and width as compared to the capacitance-forming portion.