MLCC Surface Coating for Moisture-Resistant Miniaturization
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Solution Overview
Problem
Multilayer ceramic capacitors face reliability issues due to moisture penetration, especially in high temperature, high humidity, and high voltage environments, exacerbated by the miniaturization and thinning of components, which complicates physical defect control and leads to potential electrical shorts and reduced capacitance.
Innovation Solution
A multilayer electronic component with a coating layer containing silicon (Si) and fluorine (F) applied to the external surface, with an average thickness of 5 nm to 15 nm, to enhance moisture resistance and prevent penetration through external electrodes and body interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of external electrodes, cover portion, and margin portion is reduced to achieve miniaturization and high capacitance, then the capacitance and size requirements are met, but physical defect control becomes difficult and reliability deteriorates
Solution Approach 1:
A coating layer with thickness of 5 nm to 15 nm is applied on the external surface of the electronic component body. This thin film coating provides moisture barrier protection without adding significant thickness, enabling miniaturization while maintaining reliability by preventing moisture penetration through the thinned external electrodes and cover portions.
Solution Approach 2:
The coating layer contains silicon (Si) and fluorine (F) elements, forming a composite material structure that combines the ceramic body with a specialized protective coating. This composite approach provides enhanced moisture resistance and chemical stability, addressing reliability concerns while maintaining the miniaturized structure.
2Reliability
If a coating layer is applied to improve moisture resistance, then reliability improves, but device complexity and manufacturing steps increase
Solution Approach 1:
A thin coating layer of 5 nm to 15 nm is applied on the external surface, providing moisture protection without significantly increasing device complexity. The thin film approach maintains the compact structure while delivering the required reliability improvement.
Solution Approach 2:
The coating layer contains specific elements (Si and F) with controlled composition and thickness parameters. By optimizing these parameters, the coating provides effective moisture barrier properties while minimizing the impact on device complexity and manufacturing complexity.
3Reliability
If a thick coating layer is applied to prevent moisture penetration, then moisture resistance improves, but mounting characteristics deteriorate
Solution Approach 1:
A thin coating layer of 5 nm to 15 nm is applied, which is sufficient to provide moisture barrier protection while being thin enough to maintain good mounting characteristics. This thickness range prevents excessive coating from interfering with soldering and mounting processes.
Solution Approach 2:
The coating thickness is precisely controlled within 5 nm to 15 nm, and the composition is optimized to balance moisture resistance with mounting performance. This parameter optimization ensures that the coating provides protection without compromising ease of mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating layer effectively improves moisture resistance reliability and maintains mounting properties, reducing defects and electrical connectivity issues while supporting miniaturization and high capacitance demands.
Implementation Method 1
a coating layer disposed on an external surface of the electronic component body, and containing one or more of silicon (Si) and fluorine (F)
Data Source
AI summary
A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.