MLCC Outer Electrode Structure for Crack-Resistant Thin Film Edges
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with cracks extending from stress concentration at the base film due to thermal stress, particularly in small-sized devices where the end portion of the base film is fixed to the multilayer body and coated with a plating film.
Innovation Solution
The end edge portion of the thin film layer adjacent to the center of the multilayer body is spaced apart from the multilayer body, dispersing stress and preventing crack extension by using a thin film layer with a lower and upper plating layer configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the end portion of the base film is fixed to the multilayer body and coated with a plating film, then the electrical connection and mechanical strength are improved, but stress concentration occurs at the base film leading to crack extension
Solution Approach 1:
The base film is divided into a fixed portion (at the end surface) and a non-fixed portion (at the center), allowing different regions to serve different functions: electrical connection at the end and stress relief at the center
Solution Approach 2:
Different portions of the base film have different properties: the end portion is fixed to provide electrical connection, while the center portion is non-fixed to provide stress relief and prevent crack extension
2Volume of moving object
If the multilayer ceramic capacitor is made smaller in size and thickness, then the device integration is improved, but stress concentration and crack risk increase
Solution Approach 1:
The base film is segmented into fixed and non-fixed portions, with the non-fixed center portion acting as a stress relief zone that becomes increasingly important in small-sized capacitors where stress concentration is more severe
Data Source
AI summary
A multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, first and second main surfaces, first and second side surfaces, first and second end surfaces, and first and second internal electrode layers laminated alternately with the plurality of dielectric layers and respectively exposed on the first and second end surfaces, a first outer electrode covering portions of the first end surface and the first main surface, and a second outer electrode covering portions of the second end surface and the first main surface. The first and second outer electrodes each include a thin film layer, a lower plating layer, an upper plating layer, and a front plating layer. An end edge portion of the thin film layer located adjacent to a center of the multilayer body is spaced apart from the multilayer body.