MLCC Sealing Thin Film for Microhole Fluid Blocking
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Solution Overview
Problem
Multilayer ceramic capacitors face defects that create paths for fluid penetration, leading to potential electrical failures and degradation, especially as electronic devices miniaturize and demand for high capacitance increases.
Innovation Solution
The introduction of a microbody with dielectric layers and internal electrodes, sealed by a sealing thin film using a vapor deposition process, which blocks fluid penetration by filling microholes and sealing the external interface between electrodes and the body, ensuring robustness and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multilayer capacitor is miniaturized with high capacitance, then component size is reduced and capacitance is increased, but defects occur creating paths for fluid penetration
Solution Approach 1:
A sealing thin film is formed on the outer surface of the multilayer capacitor body and extends into microholes to seal them. This thin film structure prevents fluid penetration through defects while maintaining the miniaturized size and high capacitance of the capacitor.
Solution Approach 2:
The sealing thin film acts as an intermediary layer between the external environment and the internal components of the capacitor. It blocks fluid penetration paths created by defects in the miniaturized structure, protecting internal electrodes and dielectric layers from fluid damage.
2Reliability
If sealing thin film is formed by vapor deposition, then fluid penetration is blocked, but manufacturing process complexity increases
Solution Approach 1:
The mechanical sealing approach is replaced with a vapor deposition process that forms a sealing thin film. This substitutes complex mechanical sealing structures with a more straightforward deposition process, reducing manufacturing complexity while maintaining effective fluid penetration blocking.
Solution Approach 2:
The sealing is achieved by changing the physical state and properties of the sealing material through vapor deposition. By controlling deposition parameters such as thickness and material composition, effective sealing is achieved without requiring complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents fluid permeation, enhancing the reliability and longevity of multilayer ceramic capacitors by ensuring that internal components remain protected from moisture and plating solutions, thereby maintaining electrical integrity and capacitance.
Implementation Method 1
forming a sealing thin film on a microbody by a vapor deposition process
Data Source
AI summary
An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.