Multilayer Ceramic Capacitor Structure for Thin Modules With Bending Strength
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in reducing thickness for circuit modules without compromising bending strength, as thinning the dielectric and internal electrode layers decreases their handling and structural integrity.
Innovation Solution
A multilayer ceramic capacitor design with two capacitance portions and external electrode pairs, where one portion is selectively removed to reduce thickness, maintaining the bending strength and incorporating a resin mold for enhanced structural support and surface roughness adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of multilayer ceramic capacitors is reduced by thinning dielectric layers and internal electrode layers, then the thickness parameter is improved, but the bending strength and handling difficulty deteriorate
Solution Approach 1:
The multilayer body is segmented into a first capacitance portion and a second capacitance portion, with at least one capacitance portion being removable. This segmentation allows the capacitor to be manufactured with sufficient thickness for strength, then selectively thinned by removing one capacitance portion after assembly, thereby resolving the contradiction between initial strength requirements and final thickness goals
Solution Approach 2:
The capacitor is initially manufactured with full thickness to ensure bending strength and handling ease during assembly. After mounting on the circuit board, one capacitance portion is removed to achieve the desired thin profile. This preliminary action of maintaining full thickness during manufacturing eliminates the trade-off between strength and thickness
2Length of moving object
If the number of dielectric layers and internal electrode layers is reduced to decrease thickness, then the thickness parameter is improved, but the handling difficulty increases
Solution Approach 1:
By dividing the capacitor into removable capacitance portions, the structure maintains sufficient layer count for handling during assembly, then achieves thinness by removing one segment afterward. This segmentation decouples the handling phase from the final thickness requirement
Solution Approach 2:
The capacitor is assembled in its complete form with adequate layers for handling, then thinned post-assembly by removing one capacitance portion. This preliminary assembly approach ensures ease of operation during manufacturing while achieving the target thickness afterward
Data Source
AI summary
A multilayer ceramic capacitor includes a multilayer body including dielectric layers including a ceramic material and internal electrode layers laminated therein, and two external electrode pairs each provided on a corresponding one of two main surfaces of the multilayer body. The multilayer body includes a first capacitance portion including a first portion of the internal electrode layers and a second capacitance portion including a second portion of the internal electrode layers. The first portion of the internal electrode layers in the first capacitance portion is connected to a first of the two external electrode pairs, and the second portion of the internal electrode layers in the second capacitance portion is connected to a second of the two external electrode pairs.