Multilayer Ceramic Capacitor Electrode Structure for Thin Plating Adhesion
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in downsizing while maintaining capacitance due to the thickness of outer electrodes, and there is a need to enhance the adhesion between outer electrodes and the multilayer body to improve reliability and electrical characteristics.
Innovation Solution
The multilayer ceramic capacitor incorporates underlying electrodes composed of sintered bodies of dielectric particles, with at least part of these sintered bodies located on the interface between the underlying electrodes and the multilayer body, enhancing adhesion through the formation of networks that bridge the underlying electrodes to the multilayer body, allowing for thinner outer electrodes formed by plating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If outer electrodes are formed as plating layers to reduce thickness, then the multilayer ceramic capacitor can be downsized, but the adhesion between outer electrodes and multilayer body deteriorates
Solution Approach 1:
An underlying electrode is introduced as an intermediary layer between the outer electrode (plating layer) and the multilayer body. This underlying electrode serves as a bonding bridge that enhances adhesion between the thin plating layer and the ceramic substrate, resolving the contradiction between reducing outer electrode thickness and maintaining reliable bonding.
Solution Approach 2:
The electrode structure is designed as a composite system consisting of multiple materials: the outer electrode (plating layer), the underlying electrode (with specific composition including metal particles and glass component), and the multilayer body. This composite structure combines the advantages of thin plating for downsizing with the bonding capabilities of the specially formulated underlying electrode.
2Volume of moving object
If outer electrode thickness is reduced to downsize the capacitor, then volume decreases, but electrical characteristics deteriorate
Solution Approach 1:
The underlying electrode acts as a mediator that compensates for the reduced thickness of the outer electrode. By providing a substantial bonding and conductive layer between the thin plating and the multilayer body, it maintains electrical characteristics while allowing the outer electrode to be thinner for downsizing.
Solution Approach 2:
The invention changes the structural parameters of the electrode system by introducing a multi-layer configuration with specific thickness ratios. The underlying electrode has a thickness of 1-5 μm while the outer electrode is reduced to 5-20 μm, optimizing both size and electrical performance through parameter adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the capacitor to be downsized without reducing capacitance, while improving adhesion and reliability by mitigating separation between the underlying electrodes and the multilayer body, thus maintaining high electrical characteristics.
Implementation Method 1
the first underlying electrode contains multiple sintered bodies composed of dielectric particles, and at least part of the multiple sintered bodies are located on an interface between the first underlying electrode and the multilayer body
Data Source
AI summary
A multilayer electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, underlying electrodes, and outer electrodes. The inner electrodes include first inner electrodes and second inner electrodes. The underlying electrodes include a first underlying electrode and a second underlying electrode. The outer electrodes include a first outer electrode and a second outer electrode. The first underlying electrode and the second underlying electrode each include multiple sintered bodies composed of dielectric particles. At least part of the multiple sintered bodies are located on an interface between each underlying electrode and the multilayer body.