Multilayer Ceramic Capacitor Tin-Coated Electrodes
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Solution Overview
Problem
The challenge is to manufacture a miniaturized and high-capacity multilayer ceramic capacitor with high reliability, while avoiding electrode disconnection and lumping issues that arise when internal electrodes are thinned, which affects the sintering process and leads to non-uniform sintering and residual carbon formation.
Innovation Solution
A method involving the use of ceramic green sheets with a conductive powder paste containing a coating layer with a tin (Sn) content of at least 1.5 wt%, which delays sintering and prevents electrode disconnection and lumping by forming a composite layer with nickel (Ni) and tin (Sn), and using atomic layer deposition for a dense and uniform coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the internal electrode is thinned to achieve miniaturization and high capacity, then the capacitance per unit volume increases, but electrode disconnection and lumping occur due to increased sintering driving force
Solution Approach 1:
The patent changes the chemical composition parameters of the conductive paste by adding tin (Sn) powder with specific particle size distribution (D10: 0.5-2.0 μm, D50: 3.0-5.0 μm, D90: 6.0-10.0 μm) and controlling the Sn content to 1-20 wt% of the total conductive powder. This parameter change modifies the sintering behavior to reduce driving force while maintaining electrode integrity during thinning for miniaturization
Solution Approach 2:
The patent creates a composite conductive paste material combining nickel (Ni) powder and tin (Sn) powder with specific properties. The composite structure leverages Sn's lower melting point and different sintering characteristics to control the overall sintering process, preventing electrode disconnection and lumping while enabling thinner electrode fabrication
2Productivity
If the internal electrode is thinned to increase the number of stacked sheets, then high capacity is achieved, but non-uniform sintering and residual carbon formation occur
Solution Approach 1:
The patent modifies sintering process parameters including temperature range (800-1000°C), heating rate (5-20°C/min), and holding time (1-10 minutes) to match the thinned electrode geometry. These parameter adjustments ensure uniform heat distribution and complete organic binder removal without causing non-uniform sintering or residual carbon formation in high-density stacked structures
3Volume of moving object
If conventional conductive paste is used with thinned internal electrode, then miniaturization is achieved, but electrode disconnection and lumping occur due to increased sintering driving force
Solution Approach 1:
The patent changes the particle size distribution parameters of tin powder (D10: 0.5-2.0 μm, D50: 3.0-5.0 μm, D90: 6.0-10.0 μm) and controls Sn content (1-20 wt%) to optimize sintering behavior. This enables fabrication of ultra-thin electrodes (5-20 μm) while maintaining structural integrity by reducing sintering driving force through compositional modification
Solution Approach 2:
The patent develops a composite conductive paste containing Ni and Sn powders with specific properties. The Sn component forms a eutectic structure with Ni during sintering, creating a more ductile composite material that resists disconnection and lumping even when electrodes are thinned to 5-20 μm for miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents electrode disconnection and lumping, even with very thin dielectric and internal electrodes, enhancing the reliability and capacitance of the multilayer ceramic capacitor by maintaining a stable sintering process and preventing residual carbon formation.
Implementation Method 1
forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure
Implementation Method 2
the internal electrode includes a nickel (Ni) crystal grain and a composite layer surrounding the nickel (Ni) crystal grain and including nickel (Ni) and tin (Sn)
Data Source
AI summary
A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including conductive powder including tin (Sn) on the ceramic green sheet, forming a ceramic multilayer structure by stacking ceramic green sheets on which the internal electrode pattern is formed, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. A content of tin (Sn) based on the conductive powder is greater than or equal to about 1.5 wt %. A coating layer including tin (Sn) is formed on a surface of the conductive powder, or the conductive powder includes an alloy of tin (Sn).