Multilayer Ceramic Capacitor Tin Nickel Plating Moisture Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with moisture resistance reliability due to plating discontinuation and glass beading phenomena, which compromise their performance in diverse environments.
Innovation Solution
A multilayer ceramic capacitor design featuring a first plating portion with alternately stacked tin (Sn)-plated and nickel (Ni)-plated layers, and a second plating portion with a conventional Ni-plated layer and Sn-plated layer, along with a tin-nickel intermetallic compound layer at the interface, to prevent plating discontinuation and enhance moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a general plating method is used to form Ni-plated layer and Sn-plated layer on the electrode layer, then the manufacturing process is simple, but plating discontinuation occurs and moisture resistance reliability deteriorates
Solution Approach 1:
The plating structure is segmented into multiple distinct layers: electrode layer, Ni-plated layer, Sn-plated layer, and glass beading prevention layer. This segmentation allows each layer to perform its specific function independently, preventing plating discontinuation and improving moisture resistance reliability without excessive complexity
Solution Approach 2:
The invention uses composite plating structure combining different materials (Ni, Sn, and glass-containing prevention layer) to achieve superior performance. The composite structure leverages the advantages of each material: Ni for adhesion, Sn for corrosion resistance, and the glass layer for preventing beading and discontinuation
2Manufacturing precision
If the plating layers are formed using conventional methods, then the manufacturing process is straightforward, but glass beading phenomenon occurs causing plating discontinuation
Solution Approach 1:
The glass beading prevention layer is formed preliminarily on the electrode layer before the Ni and Sn plating layers are applied. This preliminary action prevents glass beading and plating discontinuation during subsequent plating processes, ensuring manufacturing precision without significantly complicating the overall manufacturing process
Solution Approach 2:
The glass beading prevention layer acts as an intermediary layer between the electrode layer and the metal plating layers. It mediates the interaction between the electrode and plating materials, preventing harmful glass beading while maintaining ease of manufacture through a straightforward multi-layer deposition process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents plating discontinuation and Sn agglomeration, thereby improving the moisture resistance reliability and maintaining capacitor performance across various environments.
Implementation Method 1
The first plating portion includes a plurality of plating layers in which a tin (Sn)-plated layer and a nickel (Ni)-plated layer are alternately stacked
Implementation Method 2
A tin-nickel (Sn—Ni) intermetallic compound layer at an interfacial area between the tin (Sn)-plated layer and the nickel (Ni)-plated layer of the first plating portion
Data Source
AI summary
A multilayer ceramic capacitor includes a body and an external electrode on the body. The body includes a dielectric layer and an internal electrode. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion on the electrode layer, and a second plating portion on the first plating portion. The first plating portion includes a plurality of plating layers in which a tin (Sn)-plated layer and a nickel (Ni)-plated layer are alternately stacked.