Multilayer Ceramic Capacitor Vertical Mounting for High Density

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Solution Overview

Problem

There is a need to miniaturize and increase the capacitance of multilayer ceramic capacitors to meet the demands of miniaturized and multi-functional electronic devices, particularly in high frequency applications, while ensuring effective noise removal and efficient mounting on circuit boards.

Innovation Solution

A multilayer ceramic capacitor design with a ceramic body having dielectric layers stacked in a thickness direction, internal electrodes with lead parts exposed on side surfaces, and external electrodes connected to these lead parts, covered by an insulating layer, which allows for increased capacitance and secure mounting on a printed circuit board with improved mounting density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the multilayer ceramic capacitor is miniaturized to meet the demand for smaller electronic devices, then the device size is reduced, but the capacitance increases and mounting density improves

Engineering Contradiction:
Improvecapacitor sizeVSAvoidcapacitance
Core Design Contradiction:
Volume of moving objectVSQuantity of substance

Solution Approach 1:

The patent changes the mounting orientation from horizontal to vertical (standing upright), utilizing the height dimension of the capacitor body. This dimensional change allows the capacitor to achieve higher mounting density and effective capacitance per unit area on the circuit board, resolving the contradiction between miniaturization and capacitance requirement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the capacitor is miniaturized for high frequency applications, then the device size is reduced, but the noise removal effectiveness must be maintained

Engineering Contradiction:
Improvecapacitor sizeVSAvoidhigh frequency noise
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

By mounting the capacitor vertically and extending external electrodes to the main surface, the patent creates optimal electrical connection paths that effectively bypass high frequency noise while maintaining compact dimensions. This dimensional reconfiguration improves noise removal performance without increasing device size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If the external electrodes are extended to the main surface, then the mounting density is improved, but the device complexity increases

Engineering Contradiction:
Improvemounting densityVSAvoidelectrode structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent employs asymmetric electrode configuration where external electrodes are selectively extended to the main surface based on functional requirements. This asymmetric design optimizes mounting density for high-frequency applications while avoiding unnecessary complexity in structures that do not require such extensions.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS9576732B2Multilayer ceramic capacitor and mounting board therefor
Publication Date: 2017.02.21 SAMSUNG ELECTRO MECHANICS CO LTD
  • US9576732B2 patent drawing
  • US9576732B2 patent drawing
  • US9576732B2 patent drawing

AI summary

There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and satisfying T/W>1.1 when a width thereof is defined as W and a thickness thereof is defined as T; first internal electrodes each having a first lead part exposed to at least one side surface of the ceramic body; second internal electrodes each having a second lead part exposed to the at least one side surface of the ceramic body; first and second external electrodes electrically connected to the first lead part and the second lead part, respectively, and extended from the side surface of the ceramic body to which the first lead part and the second lead part are exposed to at least one of the first and second main surfaces; and an insulating layer formed to cover the first and second external electrodes formed on the first and second side surfaces.