MLCC Via Electrode Layout for Firing Shrinkage Reliability
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face issues such as internal electrode shrinkage and cracking during the firing process, leading to broken connections between internal and external electrodes, which reduces capacitance.
Innovation Solution
The multilayer electronic component design includes a body with internal electrodes alternately disposed with dielectric layers, external electrodes connected to the internal electrodes, and connection electrodes that penetrate the dielectric layer to connect adjacent internal electrodes, featuring shifted via electrodes to enhance mechanical strength and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If internal electrodes are used in multilayer ceramic capacitor, then capacitance is achieved, but internal electrode shrinkage and cracking occur during firing process causing broken connections
Solution Approach 1:
The patent applies preliminary action by forming via electrodes in the green state (before firing) that extend beyond the internal electrodes. This preliminary structure is designed to compensate for the expected shrinkage and cracking that will occur during the firing process, ensuring continuous electrical connection is maintained despite the dimensional changes.
Solution Approach 2:
The via electrodes serve as a cushioning structure that anticipates and compensates for the harmful effects of internal electrode shrinkage and cracking. By extending the via electrodes beyond the internal electrodes in the green state, the design creates a buffer zone that maintains electrical continuity even when the internal electrodes deform or crack during firing.
2Reliability
If via electrodes are formed to connect internal electrodes, then electrical connection is improved, but mechanical strength may be compromised due to additional penetration points
Solution Approach 1:
The patent resolves this contradiction by extending the via electrodes not only vertically through the dielectric layers but also horizontally beyond the boundaries of the internal electrodes. This dimensional extension allows the via electrodes to maintain electrical connection while distributing mechanical stress over a larger area, thereby preserving mechanical strength.
3Volume of stationary object
If internal electrodes are shrunk during firing, then densification is achieved, but connection between internal and external electrodes is broken
Solution Approach 1:
The via electrodes are preliminarily formed to extend beyond the internal electrodes before firing occurs. This preliminary extension ensures that when the internal electrodes shrink during firing to achieve densification, the via electrodes maintain continuous electrical connection to the external electrodes, preventing connection breakage.
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; a first external electrode disposed on at least one surface among the first, second, fifth and sixth surfaces; a second external electrode disposed on at least one surface among the first, second, third and fourth surfaces; and a first connection electrode penetrating the dielectric layer and connecting two first internal electrodes adjacent to each other in the first direction. In the first connection electrode, a plurality of first via electrodes shifted from each other in a direction perpendicular to the first direction are laminated in the first direction.