Multilayer Ceramic Capacitor with Via Electrodes for Low ESL
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method of combining multiple three-terminal multilayer ceramic capacitors to reduce mounting area does not effectively achieve low equivalent series inductance (ESL) characteristics, which is necessary for stabilizing power supply circuits and reducing noise in high-frequency electronic devices like smartphones.
Innovation Solution
A multilayer ceramic electronic component with a body featuring alternately arranged internal electrodes of different polarities, connected to external electrodes on opposing sides and via electrodes, which increase the number of current paths and reduce ESL while minimizing the mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple three-terminal capacitors are combined to reduce mounting area, then the mounting area is reduced, but the ESL is not sufficiently reduced
Solution Approach 1:
The capacitor is divided into multiple unit capacitors arranged in a matrix pattern, where each unit capacitor contributes to the overall capacitance while maintaining short current paths. This segmentation allows achieving low ESL without requiring multiple separate capacitor components, thus reducing mounting area while improving ESL characteristics.
Solution Approach 2:
Multiple unit capacitors are merged into a single integrated multilayer ceramic capacitor structure with shared internal and external electrodes. This merging achieves both the capacitance of multiple capacitors and the low ESL of a single capacitor by creating parallel current paths within the unified structure.
2Reliability
If the number of external electrodes is increased to reduce ESL, then the ESL is reduced, but the device complexity increases
Solution Approach 1:
Each external electrode serves multiple functions: it acts as a terminal for capacitance formation, a current path conductor for ESL reduction, and a mounting point for board connection. This multi-functionality allows achieving low ESL with a moderate number of external electrodes without proportionally increasing device complexity.
Solution Approach 2:
The capacitor utilizes three-dimensional electrode arrangement with internal electrodes extending in multiple directions and connecting to external electrodes on different surfaces. This spatial dimensionality creates multiple parallel current paths without requiring a proportional increase in the number of external electrode terminals.
3Reliability
If the current path length is reduced to achieve low ESL, then the ESL is reduced, but the capacitance value decreases
Solution Approach 1:
The capacitor is segmented into multiple unit capacitors with their own internal electrodes and dielectric layers. Each unit contributes to the total capacitance while maintaining short current paths. The segmented structure allows parallel current paths that reduce ESL while the cumulative effect of multiple units maintains high capacitance value.
Solution Approach 2:
Multiple parallel current paths are created through the segmented unit capacitor structure, allowing continuous current flow through multiple routes simultaneously. This continuity maintains low ESL by providing alternative paths while the combined capacitance of all units ensures sufficient capacitance value.
Data Source
AI summary
A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.