Multilayer Ceramic Capacitor Vibration Absorption
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise due to piezoelectric vibrations, which existing solutions attempt to mitigate by increasing the distance between the capacitor and the circuit board, leading to height constraints and inefficiencies.
Innovation Solution
A multilayer ceramic capacitor design featuring a ceramic body with dielectric layers, internal and external electrodes, and dummy electrodes configured to absorb vibrations, reducing acoustic noise without increasing the overall height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between the multilayer ceramic capacitor and the circuit board is increased to decrease acoustic noise, then the acoustic noise is reduced, but the height of the product increases
Solution Approach 1:
The patent introduces a vibration-absorbing structure as an intermediary element between the multilayer ceramic capacitor and the circuit board. This mediator absorbs the vibrations generated by the capacitor, preventing them from being transmitted to the circuit board and reducing acoustic noise, while allowing the capacitor to be mounted at a standard height without requiring increased spacing.
Solution Approach 2:
The patent extracts the vibration absorption function from the mounting structure itself, creating a separate vibration-absorbing component. This extracted function is then integrated into the mounting structure, allowing the structure to simultaneously perform both mechanical support and vibration damping functions without increasing the overall height.
2Object-affected harmful factors
If a metal frame is used to mount the multilayer ceramic capacitor at a predetermined distance to decrease acoustic noise, then the acoustic noise is reduced, but the device complexity increases
Solution Approach 1:
The patent designs the mounting structure to perform multiple functions simultaneously: mechanical support for the capacitor, vibration absorption to reduce acoustic noise, and electrical connection provision. This multi-functional design eliminates the need for separate metal frames or additional vibration damping components, thereby reducing device complexity while maintaining noise reduction effectiveness.
Solution Approach 2:
The patent merges the vibration absorption function with the mounting structure by integrating a vibration-absorbing layer into the mounting structure itself. This combination eliminates the need for separate metal frames or additional vibration damping components, simplifying the overall device structure while maintaining noise reduction effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively decreases acoustic noise by absorbing vibrations within the capacitor, maintaining a compact form factor.
Implementation Method 1
since the dielectric layers have piezoelectric properties, when direct current (DC) voltage or alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may be generated between the internal electrodes, such that a volume of a ceramic body is expanded and contracted according to frequency, thereby generating periodic vibrations
Implementation Method 2
third and fourth internal electrodes disposed to face each other on a single dielectric layer of the upper or lower cover layer and connected to the first and second terminal electrodes, respectively
Data Source
AI summary
There is provided a multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second external electrodes formed on end surfaces of the ceramic body; first and second terminal electrodes formed on side surfaces of the ceramic body; an active layer including a first internal electrode simultaneously connected to the first terminal electrode and the first external electrode and a second internal electrode simultaneously connected to the second terminal electrode and the second external electrode; upper and lower cover layers formed above and below the active layer; and third and fourth internal electrodes disposed to face each other on a single dielectric layer of the upper or lower cover layer and connected to the first and second terminal electrodes, respectively.