Multilayer Ceramic Capacitor Mounting Structure for Vibration Damping
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Solution Overview
Problem
Conventional multilayer ceramic capacitor mounting structures either increase the capacitor mounting area or the height of the capacitor, making them unsuitable for applications with height constraints and failing to effectively reduce vibration sounds without spacing the capacitor from the substrate.
Innovation Solution
A multilayer ceramic capacitor mounting structure where the capacitor is mounted with inner electrodes parallel to the substrate, a specific height-to-thickness ratio (Tf/T > 0.1), relative permittivity (300 ≤ εr ≤ 2800), and a width-to-land-size ratio (0.6 ≤ Wp/W ≤ 1.0) are defined to minimize vibration propagation to the substrate, ensuring joint strength and capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple ceramic capacitors are arranged in a row on the circuit board, then vibration sounds are suppressed through opposite phase vibrations, but the capacitor mounting area increases
Solution Approach 1:
The patent merges the vibration suppression function into a single capacitor by controlling its internal structure (dielectric layer thickness ratio Tf/T ≥ 0.1) rather than requiring multiple capacitors arranged in specific patterns. This combines the capacitance function and vibration suppression function into one component, reducing the total mounting area while maintaining vibration sound suppression效果
Solution Approach 2:
The patent changes the physical parameters of the capacitor (dielectric layer thickness ratio Tf/T, relative permittivity εr, inner electrode arrangement) to achieve vibration suppression. By adjusting these parameters, the capacitor's vibration characteristics are modified to suppress vibration sounds without requiring additional capacitors or increased mounting area
2Object-affected harmful factors
If metal terminals are used to space the capacitor body from the substrate, then vibration propagation is reduced, but the height of the ripple capacitor increases
Solution Approach 1:
The patent extracts the vibration suppression function from the mounting structure (metal terminals spacing the capacitor) and transfers it to the capacitor's internal structure (dielectric layer thickness ratio Tf/T ≥ 0.1). This removes the need for additional height-increasing mounting components while maintaining vibration propagation suppression
Solution Approach 2:
The patent changes the capacitor's internal structural parameters (dielectric layer thickness, relative permittivity εr) to achieve vibration suppression inherently, eliminating the need for external spacing structures that would increase the overall height of the capacitor assembly
3Object-affected harmful factors
If the capacitor is mounted with inner electrodes parallel to the substrate, then vibration propagation to the substrate is reduced, but the mounting orientation is more restrictive
Solution Approach 1:
The patent changes the capacitor's internal parameters (dielectric layer thickness ratio Tf/T, relative permittivity εr) to achieve vibration suppression that is effective regardless of mounting orientation. This parameter optimization allows the capacitor to maintain vibration suppression performance while providing mounting orientation flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces vibration sounds on the substrate without increasing the mounting area or spacing the capacitor, while maintaining joint strength and capacitor capacity, allowing for more efficient and compact mounting of multiple capacitors.
Implementation Method 1
the relationship between the height T of the multilayer ceramic capacitor, the outer covering thickness Tf of the element body, and the relative permittivity εr of the dielectric layers... Setting the relative permittivity εr of the dielectric layers to at least 300 but not exceeding 2800 is supposed to make it harder for the vibrations generated in the multilayer ceramic capacitor to propagate to the substrate
Data Source
AI summary
A multilayer ceramic capacitor has an element body formed by alternately laminating a plurality of dielectric layers and a plurality of inner electrodes. On a substrate having a mounting surface provided with at least two lands, the multilayer ceramic capacitor is mounted such that the inner electrodes are parallel to the mounting surface. A multilayer ceramic capacitor mounting structure satisfies Tf/T>0.1 and 300≦εr≦2800, where T is the height of the multilayer ceramic capacitor, Tf is the outer covering thickness of the element body, and εr is the relative permittivity of the dielectric layers, and 0.6≦Wp/W≦1.0, where W is the width of the multilayer ceramic capacitor, and Wp is the size of the land in a direction corresponding to the width of the multilayer ceramic capacitor.