Multilayer Ceramic Capacitor Acoustic Noise Reduction

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Solution Overview

Problem

Multilayer ceramic capacitors generate significant acoustic noise due to piezoelectric vibrations transmitted through external electrodes and solder to printed circuit boards, causing discomfort through audible frequencies.

Innovation Solution

The multilayer ceramic capacitor design includes conductive glass and resin layers with insulating layers to minimize vibration transfer, featuring conductive glass layers extending from end surfaces to main surfaces, and conductive resin layers with a wider width than glass layers, covered by insulating layers of epoxy resist, which reduce the formation of solder on non-mounting surfaces, thereby decreasing acoustic noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the solder volume and height are increased to improve electrical connection, then the electrical reliability is improved, but the acoustic noise increases due to enhanced vibration transfer

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidacoustic noise
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies different properties to different parts of the external electrode structure. The end surfaces have inclined solder regions for reliable electrical connection, while the side surfaces are covered with insulating layers to prevent solder formation and reduce vibration transfer. This local differentiation allows the structure to simultaneously achieve good electrical connection and reduced acoustic noise.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The external electrode structure is segmented into functional regions: conductive glass layers for electrical connection, conductive resin layers for mechanical support, and insulating layers for vibration isolation. This segmentation allows each layer to perform its specific function optimally, balancing electrical reliability and noise reduction.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If the external electrode structure is simplified to reduce manufacturing complexity, then the device complexity is reduced, but the acoustic noise control capability is worsened

Engineering Contradiction:
Improveexternal electrode structure complexityVSAvoidacoustic noise
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The external electrode uses a composite structure with multiple materials: conductive glass layers for electrical conductivity, conductive resin layers for mechanical properties, and insulating layers for vibration isolation. This composite approach achieves effective acoustic noise control while maintaining a manufacturable structure through established layering techniques.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If the solder is allowed to form on all surfaces for complete coverage, then the manufacturing simplicity is improved, but the acoustic noise increases due to vibration transfer through solder on non-mounting surfaces

Engineering Contradiction:
Improvesolder formation simplicityVSAvoidacoustic noise
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The insulating layers are formed on the side surfaces before soldering to prevent solder from forming on these surfaces. This preliminary protective action ensures that even when solder is applied comprehensively, it will not adhere to the side surfaces, thereby preventing vibration transfer and acoustic noise generation from non-mounting surfaces.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces acoustic noise by minimizing vibration transfer and solder volume, improving component reliability even in high-density mounting configurations.

Implementation Method 1

first and second insulating layers formed to be extended from the third and fourth end surfaces to portions of the first and second main surfaces so as to cover the first and second conductive glass layers and the first and second conductive resin layers formed on the third and fourth end surfaces

Methodology Applied
Scientific EffectVibration isolation: Damping

Implementation Method 2

since the dielectric layers have piezoelectric properties, when a direct current (DC) voltage or an alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may be generated between the internal electrodes, such that a volume of a ceramic body is expanded and contracted according to a frequency

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS9245690B2Multilayer ceramic capacitor, board having the same mounted thereon, and method of manufacturing the same
Publication Date: 2016.01.26 SAMSUNG ELECTRO MECHANICS CO LTD
  • US9245690B2 patent drawing
  • US9245690B2 patent drawing
  • US9245690B2 patent drawing

AI summary

There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to the third and fourth end surfaces, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive glass layers; first and second conductive resin layers containing copper and an epoxy; and first and second insulating layers.