Multilayer Ceramic Capacitor Vibration Isolation via Extended Electrodes

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Solution Overview

Problem

Multilayer ceramic capacitors generate acoustic noise due to piezoelectric vibrations transferred to printed circuit boards, and existing solutions that increase the height of metal terminals to mitigate this noise are not feasible in products with height limitations.

Innovation Solution

The design includes a ceramic body with dielectric layers and internal electrodes, where external electrodes have internal conductive layers extended to the main surface with insulating layers of 50 μm or more, formed using insulating epoxy, and external conductive layers formed on these internal conductive layers, which reduces vibration transfer by increasing the separation distance from the printed circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the height of metal terminals is increased to reduce acoustic noise, then acoustic noise is decreased, but the overall component height increases making it unsuitable for height-limited products

Engineering Contradiction:
Improveacoustic noiseVSAvoidcomponent height
Core Design Contradiction:
Object-affected harmful factorsVSLength of moving object

Solution Approach 1:

The patent transitions from vertical noise reduction (increasing terminal height) to horizontal noise reduction (increasing pad area on the mounting surface). By expanding the electrode pads in the plane direction rather than the thickness direction, the patent achieves vibration isolation without increasing component height, thus resolving the contradiction between noise reduction and compact form factor.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If metal terminals are used to mount the capacitor spaced apart from the printed circuit board, then vibration transfer is reduced, but the mounting structure becomes more complex

Engineering Contradiction:
Improvevibration transferVSAvoidmounting structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the external electrode function with the mounting pad function. The external electrodes extend to the mounting surface and form enlarged electrode pads that directly contact the printed circuit board, eliminating the need for separate metal terminals or mounting structures. This integration simplifies the mounting structure while maintaining vibration reduction benefits.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively decreases acoustic noise by increasing the separation distance and providing flexible insulation to absorb vibrations, while maintaining a compact form factor suitable for products with height constraints.

Implementation Method 1

first and second insulating layers extended from the first and second internal conductive layers on the first and second end surfaces to portions of the first and second internal conductive layers on the first main surface, respectively

Methodology Applied
Scientific EffectVibration absorption: Damping

Implementation Method 2

since the dielectric layers have piezoelectricity, when direct current (DC) or alternate current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon is generated between the internal electrodes, thereby generating periodic vibrations

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS9208949B2Multilayer ceramic capacitor
Publication Date: 2015.12.08 SAMSUNG ELECTRO MECHANICS CO LTD
  • US9208949B2 patent drawing
  • US9208949B2 patent drawing
  • US9208949B2 patent drawing

AI summary

A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers.