MLCC Assembly Vibration Isolation via Substrate
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Solution Overview
Problem
Multi-layer ceramic capacitors (MLCCs) in mobile terminals can deform under voltage changes, causing mechanical stress that is transferred to circuit boards, leading to audible acoustic noise due to vibration.
Innovation Solution
A multi-layer ceramic capacitor assembly is designed with an electrode-forming substrate and through-holes for electrical connection, along with bonding parts to separate the physical and electrical connection paths, minimizing vibration transfer to the circuit board. This includes first and second bonding parts with soldering members for secure bonding between the capacitor, substrate, and circuit board, using through-holes for efficient electrical connection and minimizing vibration transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the MLCC is directly connected to the circuit board by soldering the external electrode to the surface electrode, then electrical connectivity is achieved, but mechanical deformation is transferred to the circuit board causing vibration and acoustic noise
Solution Approach 1:
The patent divides the connection system into separate functional components: an electrode-forming substrate with through-holes that provides electrical connection paths, and a first bonding part that provides mechanical bonding. This segmentation allows the electrical connection function to be separated from the mechanical support function, preventing vibration transfer while maintaining electrical connectivity.
Solution Approach 2:
The electrode-forming substrate acts as an intermediary component between the MLCC and the circuit board. It provides through-holes for electrical connection while its structure prevents direct transmission of mechanical vibrations from the MLCC to the circuit board, thus mediating between electrical connectivity requirements and vibration reduction needs.
2Object-generated harmful factors
If an electrode-forming substrate with through-holes is introduced to separate electrical and mechanical connection paths, then vibration transfer is reduced, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the electrode-forming substrate: it provides electrical connection paths through through-holes, offers mechanical bonding surfaces for the MLCC and circuit board, and acts as a vibration isolation structure. This consolidation reduces the number of separate components needed while achieving vibration reduction.
Solution Approach 2:
The electrode-forming substrate is designed as a multi-functional component that simultaneously provides electrical connectivity, mechanical support, and vibration isolation. The through-holes serve both as electrical connection paths and as part of the overall structural design, making the component universal in its functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the transfer of vibrations from the MLCC to the circuit board, enhancing insulation and maintaining electrical connectivity while minimizing acoustic noise.
Implementation Method 1
a first bonding part disposed between the multi-layer ceramic capacitor and the electrode-forming substrate in a region where the external electrodes are not formed and configured to bond the multi-layer ceramic capacitor with the electrode-forming substrate
Implementation Method 2
current-carrying soldering members connecting the surface electrodes with the external electrodes through the through-holes in such a way that the surface electrodes are electrically connected, respectively, with the external electrodes
Data Source
AI summary
A multi-layer ceramic capacitor assembly includes a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.