MLPC Electroplated Terminal Layout for Thin Low-ESR Capacitors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional multilayer polymer capacitors face challenges in miniaturization due to limitations in lead frame bending, resulting in damaged capacitors and poor parallel effects, which restricts the production of ultra-thin capacitors with equivalent series resistance that does not meet industrial needs.
Innovation Solution
The use of electroplated positive and negative terminals as lead-out electrodes, combined with a parallel shunt configuration for the negative electrode, reduces equivalent series resistance and improves parallel effects, allowing for thinner capacitor designs without damaging the capacitor body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the capacitor is miniaturized to reduce thickness, then the capacitor size is reduced, but the lead frame bending operation damages the capacitor body
Solution Approach 1:
The patent extracts and eliminates the lead frame component from the capacitor structure. Instead of using a lead frame that requires bending, the invention directly connects electrode terminals to external leads through welding, removing the problematic intermediate component that caused damage during bending operations.
Solution Approach 2:
The patent replaces the mechanical bending operation of the lead frame with a welding process. Instead of mechanically bending the lead frame to form terminals, the invention uses welding to directly join electrode terminals to external leads, substituting a mechanical process with a thermal joining process that does not damage the capacitor body.
2Length of stationary object
If the capacitor thickness is reduced to achieve miniaturization, then the capacitor size is reduced, but the parallel effect deteriorates and equivalent series resistance increases
Solution Approach 1:
The patent segments the external lead structure into multiple separate leads (positive lead and multiple negative leads) that are directly welded to the electrode terminals. This segmentation allows for optimized current distribution and improved parallel effect without requiring thick capacitor structure, as each lead provides an independent current path.
Solution Approach 2:
The patent transitions from a planar lead frame structure to a three-dimensional arrangement of welded leads extending from the capacitor body. This dimensional change allows for better current distribution and improved parallel effect in thinner capacitor designs, as leads can be positioned in multiple spatial directions rather than confined to a single bending plane.
3Device complexity
If traditional lead frame bending is used to form terminals, then the capacitor structure is simple, but the bending operation increases capacitor thickness and affects structure and performance
Solution Approach 1:
The patent extracts and removes the lead frame component entirely from the capacitor structure. By eliminating this intermediate component, the design achieves terminal formation through direct welding of leads to electrode terminals, reducing overall capacitor thickness while maintaining structural integrity.
Solution Approach 2:
The patent changes the fundamental parameter of terminal formation from mechanical bending to thermal welding. This parameter change eliminates the need for lead frame bending operations, allowing for thinner capacitor designs without the structural compromises and thickness increases associated with bending operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of thinner capacitors with improved electrostatic capacity and reduced equivalent series resistance, breaking through size limitations and enhancing performance in smaller volumes.
Implementation Method 1
positive and negative electrode terminals are electroplated to be used as lead-out electrodes
Data Source
AI summary
A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.