mm-Wave AiP Antenna Layout for Low-Loss Compact Packaging
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Solution Overview
Problem
Existing Antenna-in-Package (AiP) solutions suffer from signal losses and increased height requirements, particularly at frequencies above 100 GHz, making them unsuitable for compact designs.
Innovation Solution
An improved AiP solution with an antenna patch and parasitic patch on the same semiconductor die, utilizing an amplifier within the die to drive the antenna, and incorporating a reflecting patch and conductive shield to minimize signal losses and reduce height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If signals are transmitted through coaxial TSVs from bottom die to top die, then high-frequency signals can be transmitted, but signal losses increase and power output decreases at frequencies above 100 GHz
Solution Approach 1:
The patent merges the RF amplifier and antenna into a single integrated structure on the top die, eliminating the need for coaxial TSV connections between separate dies. This integration reduces signal loss by removing intermediate transmission paths while maintaining high-frequency signal integrity and power output.
2Adaptability or versatility
If parasitic patches are placed above the antenna to extend bandwidth, then bandwidth is extended, but height of the assembly increases
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (increasing height) to a planar integration approach where parasitic patches are positioned in the same plane as the antenna elements. This dimensional reorganization extends bandwidth through lateral arrangement rather than vertical stacking, thereby reducing overall assembly height while maintaining enhanced bandwidth capabilities.
3Reliability
If antenna is placed on top die with coaxial TSV connection, then RF signals can be transmitted, but height requirements increase for compact designs
Solution Approach 1:
The patent combines the RF amplifier, antenna feed network, and antenna elements into a single integrated module on the top die. This merger eliminates the need for vertical coaxial TSV connections to separate dies, thereby reducing height while maintaining reliable high-frequency signal transmission through direct on-die interconnections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal losses and height, enabling efficient high-frequency operation in a compact form factor by integrating the amplifier within the die and optimizing the spacing and alignment of antenna and parasitic patches.
Implementation Method 1
an antenna patch on a first metal layer of a semiconductor die and a parasitic patch on a second metal layer of the same semiconductor die. The parasitic patch is parallel to, vertically aligned with, and spaced apart from the antenna patch
Implementation Method 2
An amplifier within the semiconductor die is configured to drive the antenna patch
Implementation Method 3
incorporating a reflecting patch and conductive shield to minimize signal losses
Implementation Method 4
conductive shield to minimize signal losses
Data Source
AI summary
An electronic device realizes an antenna-in-package (AiP). The device includes a first die having a first metal layer that defines an antenna patch, a second metal layer that defines a parasitic patch above and vertically aligned with the antenna patch, and an amplifier having an output terminal electrically coupled to the antenna patch. The device further includes a second die having a metal layer that defines a reflecting patch and an interconnect that joins the first die with the second die in a vertical stack with the first die above the second die such that the antenna patch is spaced apart from, parallel to, and vertically aligned with the reflecting patch.