Millimeter Wave CMOS Engines for Rack Scale Interconnects
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Solution Overview
Problem
Current interconnect technologies for server architectures, such as traditional electrical and optical solutions, face challenges in achieving high data rates with low power consumption and latency, especially for medium distance communications in Rack Scale Architecture (RSA) servers, where existing solutions are either power-hungry or latency-prone.
Innovation Solution
The use of millimeter wave (mm-wave) waveguides coupled with CMOS packages and III-V semiconductor technology to transmit data, enabling high data rates with reduced power consumption and error correction needs, and allowing flexible orientations and directional signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional electrical interconnects are used for medium distance communication, then data transmission is achieved, but power consumption increases and latency increases due to equalization and error correction
Solution Approach 1:
The patent replaces traditional electrical signal transmission with acoustic wave transmission through solid media. Acoustic waves propagate through the solid interconnect medium, eliminating the need for electrical equalization and error correction mechanisms, thereby reducing power consumption while maintaining transmission reliability
Solution Approach 2:
The patent changes the fundamental transmission parameter from electrical signals to acoustic waves. This parameter change enables transmission through solid media with inherently lower loss characteristics, eliminating the need for power-hungry equalization and reducing latency
2Productivity
If optical interconnect fabric is used for medium distance communication, then high data rate is achieved, but power consumption becomes excessive
Solution Approach 1:
The patent substitutes optical transmission with acoustic wave transmission through solid media. This substitution maintains high data rate capability while dramatically reducing power consumption, as acoustic waves in solids experience lower attenuation and do not require the power-intensive optical conversion and signal regeneration infrastructure
3Length of moving object
If traditional electrical cables are used to extend reach or bandwidth, then transmission capability is improved, but power consumption and cost increase due to higher quality cables and advanced techniques
Solution Approach 1:
The patent replaces electrical cable transmission with acoustic wave transmission through solid media. This enables extended transmission distances with lower power consumption, as acoustic waves in solids experience fundamentally different propagation characteristics with lower loss and no need for electrical signal boosting
Solution Approach 2:
The patent changes the transmission medium parameter from electrical conductors to solid acoustic waveguides. This parameter change enables longer transmission distances without the need for higher quality cables or advanced equalization techniques, as acoustic waves naturally maintain signal integrity over longer distances in solids
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach supports high data rates over short to medium distances with minimal power usage and reduced latency, providing a cost-effective and energy-efficient solution for server interconnects.
Implementation Method 1
mm-wave transceiver circuitry to transmit data
Data Source
AI summary
The present disclosure is directed to systems and methods for communicating between rack mounted devices disposed in the same or different racks separated by distances of less than a meter to a few tens of meters. The system includes a CMOS first mm-wave engine that includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. The CMOS first mm-wave engine communicably couples to a CMOS second mm-wave engine that also includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. In some implementations, at least a portion of the mm-wave transceiver circuitry may be fabricated using III-V semiconductor manufacturing methods. The use of mm-wave communication techniques beneficially improves data integrity and increases achievable datarates, and reduces power costs.


