mm-Wave to Optical Signal Conversion Using Segmented Integrated Chips
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Solution Overview
Problem
Current devices for converting wireless signals in the mm wave or sub-THz range to modulated optical signals are limited by high conversion loss, cost, and frequency range, often relying on expensive III-V technologies and large structures.
Innovation Solution
A compact electronic device comprising an antenna element on a printed circuit board or integrated chip, an electrical signal converter on a second integrated chip, and a modulator with a waveguide and conductive cladding on a third integrated chip, enabling low conversion loss and broad frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If expensive III-V technologies and discrete components are used, then conversion efficiency may be improved, but device cost and complexity increase
Solution Approach 1:
The device is divided into separate functional modules: antenna elements on a first integrated chip, electrical signal converter on a second integrated chip, and modulator on a third integrated chip. This segmentation allows each module to be optimized independently while reducing overall system complexity compared to monolithic III-V implementations.
Solution Approach 2:
The patent introduces intermediate layers and cladding structures with specific permittivity properties as mediators between the antenna elements and the modulator. These intermediate structures enable efficient signal coupling and reduce conversion loss without requiring complex direct integration.
2Adaptability or versatility
If discrete components and antennas are used, then frequency range coverage may be improved, but device compactness deteriorates
Solution Approach 1:
Multiple functional components (antenna elements, signal converter, modulator) that would traditionally be separate discrete devices are merged into integrated chips. The first, second, and third integrated chips combine multiple functions on single substrates, achieving compactness while maintaining broad frequency coverage through the coordinated operation of these integrated modules.
3Loss of energy
If large structures are used, then conversion efficiency may be improved, but device compactness deteriorates
Solution Approach 1:
The patent employs local quality variations through the use of cladding materials with specific permittivity properties and intermediate layers positioned at critical interfaces. These localized structural modifications enable efficient signal coupling and reduced conversion loss without requiring large overall device dimensions, thus maintaining compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves low conversion loss and broad frequency performance in a compact, cost-effective manner, improving upon existing technologies by integrating components on separate chips for efficient signal conversion.
Implementation Method 1
at least one antenna element for receiving the wireless signal and for converting the wireless signal into at least one guided electrical signal
Implementation Method 2
at least one modulator for receiving the at least one conditioned electrical signal and for converting the at least one conditioned electrical signal into the at least one modulated optical signal
Data Source
AI summary
Disclosed is an electronic device (1) for converting a wireless signal (2) in the mm-wave or sub-THz range into at least one modulated optical signal (16). The electronic device (1) comprises an antenna element (11) for converting the wireless signal (2) into a guided electrical signal (12), wherein the antenna element (11) is arranged on a printed circuit board (10b′) or on a first integrated chip (10′). The electronic device (1) comprises an electrical signal converter (13) for converting the at least one guided electrical signal (12) into a conditioned electrical signal (14), wherein the electrical signal converter (13) is arranged on a second integrated chip (10″). The electronic device (1) comprises a modulator (15) for converting the conditioned electrical signal (14) into the modulated optical signal (16), wherein the modulator (15) is arranged on a third integrated chip (10′″), and wherein the modulator (15) comprises a waveguide (151) and a cladding (152) comprising a first cladding portion (1521) having a conductive material at an interface with the waveguide (151) and a second cladding portion (1522) having a conductive material at an interface with the waveguide (151).