MMC Liquid Flow-Through Plate Bonding for Lower Thermal Rise
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Solution Overview
Problem
Electronic device packages with liquid-cooled cold plates experience additional temperature rise due to coefficient of thermal expansion (CTE) differences between the electronic device layer and the cold plate, requiring multiple material interfaces that complicate heat transfer.
Innovation Solution
A high-performance liquid flow-through plate is constructed using metal matrix composite (MMC) substrates with metallized surfaces and a braze foil, where a high-temperature and high-pressure bake creates transient liquid-phase bonding, eliminating the need for multiple interfaces by directly attaching the electronic device layer to the cold plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If multiple material interfaces are used to account for CTE difference, then CTE mismatch is managed, but thermal performance deteriorates due to additional temperature rise at each interface
Solution Approach 1:
The patent merges the electronic device layer and cold plate into a single integrated structure with a unified metallized surface, eliminating multiple material interfaces. This integration maintains CTE compatibility while removing the thermal resistance that would otherwise exist at interface boundaries, thereby reducing temperature rise and improving heat transfer efficiency.
2Stability of the object's composition
If multiple material interfaces are used to account for CTE difference, then CTE compatibility is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple layers into a single integrated component with a unified metallized surface, eliminating the need for multiple separate material interfaces. This simplification reduces structural complexity and manufacturing difficulty while maintaining CTE compatibility through the integrated design and selective metallization process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal rise by enabling direct heat transfer between electronic devices and coolant, improving thermal efficiency and reducing the complexity of material interfaces.
Implementation Method 1
executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface
Implementation Method 2
the executing of the high-temperature and high-pressure bake causes a transient liquid-phase bonding between the material of the braze foil and the metallized surface
Implementation Method 3
enabling direct heat transfer between electronic devices and coolant, improving thermal efficiency
Data Source
AI summary
A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.