MMIC Coolant Distribution Structure With Segmented Layers
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Solution Overview
Problem
Existing coolant structures for monolithic microwave integrated circuits (MMICs) face challenges in providing sufficient coolant capacity and efficiency, especially for high-density active semiconductor devices, requiring innovative designs to facilitate close proximity coolant flow while managing hardware and electrical complexities.
Innovation Solution
A coolant distribution structure for MMICs featuring an input/output port layer, a coolant pass-through layer, and a distribution layer that inhibits direct coolant flow, allowing cold coolant intake and heated coolant return, with micro-channels and partitions to enhance heat absorption and reduce pressure drop, utilizing a silicon manifold and high conductivity diamond substrate for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant flow is provided in close proximity to high-density active semiconductor devices, then heat transfer efficiency is improved, but hardware design complexity and fabrication difficulty increase
Solution Approach 1:
The coolant distribution structure is divided into multiple functional layers: an input/output port layer for coolant entry and exit, a coolant pass-through layer with distributed channels for coolant flow, and a distribution layer with micro-channels in close proximity to active devices. This segmentation allows each layer to perform its specific function optimally while reducing overall design complexity.
Solution Approach 2:
The patent transitions from planar coolant distribution to a three-dimensional multi-layer manifold structure. The vertical stacking of input/output ports, pass-through channels, and distribution micro-channels creates additional spatial dimensions for coolant flow paths, enabling close proximity cooling while managing complexity through vertical integration rather than horizontal expansion.
2Temperature
If coolant channels are positioned close to active devices, then cooling efficiency is improved, but electrical isolation challenges increase
Solution Approach 1:
The manifold structure acts as an intermediary between the coolant supply system and the active semiconductor devices. The multi-layer construction with distributed channels and micro-channels provides physical separation and electrical isolation while maintaining thermal coupling through the substrate, allowing efficient heat transfer without direct electrical contact between coolant and active devices.
3Loss of energy
If direct coolant flow path is used from input to output port, then flow resistance is reduced, but coolant short-circuiting occurs reducing cooling effectiveness
Solution Approach 1:
The coolant flow path is segmented into distinct functional zones: input ports receiving coolant, pass-through channels distributing coolant laterally, and micro-channels providing controlled flow paths close to active devices before returning to output ports. This segmentation prevents direct short-circuiting while managing pressure drop through optimized channel geometry and distribution.
Solution Approach 2:
The coolant pass-through layer performs preliminary distribution of coolant to multiple micro-channel entries before the coolant reaches the active cooling zones. This preliminary action ensures uniform coolant distribution across all micro-channels, preventing short-circuiting and maximizing cooling effectiveness while maintaining reasonable pressure drop characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure enables precise and uniform coolant distribution near active devices, reducing operating temperatures and pressure drop, while maintaining electrical isolation, thus improving heat transfer performance and coolant efficiency.
Implementation Method 1
distributing such received coolant to the cooling channels to absorb heat generated by the active devices
Implementation Method 2
utilizing a silicon manifold and high conductivity diamond substrate for efficient heat transfer
Data Source
AI summary
A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the passthrough layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.