MMIC Packaging With Patterned Electromagnetic Shielding
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Solution Overview
Problem
Microwave and mm-Wave Monolithic Integrated Circuits (MMICs) face challenges in environmental protection and performance degradation due to harsh environments, with existing coatings and packaging methods not providing full protection and increasing the size and complexity of the devices.
Innovation Solution
The integration of electromagnetic structures on the microcover, which are designed to prevent electromagnetic interactions between the MMIC and the external module environment, using materials like magnetic or dielectric layers to shield and reduce coupling, allowing for a leadless, hermetically sealed package without the need for hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional hermetic housings are used to protect MMICs from environmental damage, then environmental protection is improved, but device size and complexity increase
Solution Approach 1:
The patent extracts and eliminates the conventional hermetic housing structure by applying environmental protection coatings directly to the MMIC die surface. This removes the need for separate metallic housing components while maintaining environmental protection, thereby reducing package complexity and size.
Solution Approach 2:
The patent uses thin film coatings applied directly to the MMIC die to provide environmental protection. These thin film structures replace bulky hermetic housings, achieving protection with minimal added complexity and size.
2Ease of manufacture
If special coatings are applied to MMICs for environmental protection, then manufacturing cost is reduced, but full environmental protection and performance preservation are not achieved
Solution Approach 1:
The patent employs composite coating structures with multiple layers having different functional properties. This combination of materials provides both environmental protection and performance preservation while maintaining the cost benefits of wafer-level coating processes.
Solution Approach 2:
The patent optimizes coating parameters including thickness, material composition, and deposition conditions to achieve both full environmental protection and preservation of MMIC performance characteristics, resolving the contradiction between cost and reliability.
3Reliability
If air-cavity enclosures with micro-covers are used, then hermetic sealing is improved, but die size and module footprint increase due to bonding rings and ledges
Solution Approach 1:
The patent extracts and eliminates the need for bonding rings and ledges by applying coatings directly to the active die surface. This allows the die to maintain its minimal active area without additional structural requirements, reducing overall die size while achieving hermetic sealing through the coating layer.
4Ease of operation
If bond wires and bonding pads are used in conventional housings, then electrical connections are established, but MMIC size and substrate complexity increase
Solution Approach 1:
The patent merges the environmental protection function and electrical connection function into a single integrated coating structure. The coating provides both protection and serves as the electrical interface, eliminating the need for separate bond wires and bonding pads, thereby reducing substrate complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in invariant die properties and performance, reduced electromagnetic coupling, and increased gain for MMICs, while eliminating the need for hermetic sealing and bond wires, leading to smaller and more efficient module footprints.
Implementation Method 1
electromagnetic structures on the microcover are accounted for in the design of the MMIC. They prevent unwanted interactions through the shielding they provide
Implementation Method 2
The magnetic material shapes or features (electromagnetic structures) are printed or lithographically patterned on the inside or outside surfaces of the micro package
Data Source
Figure 1~3
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Figure 6A~7
AI summary
A method for packaging a semiconductor device. The method includes: providing a dielectric layer over the semiconductor device; determining patterns and placement of material on the dielectric layer to provide a predetermined magnetic or electric effect for the device, such effects being provided on the device from such patterned and placed material solely by electrical or magnetic waves coupled between such material and the device; and forming the material in the determined patterns and placement to provide the predetermined effects.