mmW Integrated Hinge Layout for Signal Clearance and Cooling

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Solution Overview

Problem

Managing complex interactions and interference between different wavelengths of electromagnetic waves in wireless communication devices, particularly in devices with adjustable configurations like hinged laptops, where mmW signals are obstructed by the hinge structure, leading to degraded communication performance and heat management issues.

Innovation Solution

Integration of mmW modules and antenna arrays with a hinge structure that provides multiple degrees of freedom for signal directionality and heat dissipation, using a heatsink and thermally conductive materials to minimize signal obstruction and efficiently manage thermal energy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If mmW antenna array is integrated with hinge structure, then space usage is optimized and device configuration flexibility is improved, but signal obstruction from hinge components increases

Engineering Contradiction:
Improvespace usageVSAvoidsignal obstruction
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The hinge structure is divided into multiple segments including a first joint with attachment leaf and central leaf, and a second joint with attachment leaf and central leaf. The mmW antenna array is positioned in the shared plane formed by the central leaves, creating segmented zones where the antenna operates in a dedicated space between the attachment leaves, reducing signal blockage while maintaining compact integration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent positions the mmW antenna array in a shared plane formed by the central leaves of the joints, utilizing the dimensional space between the attachment leaves. This spatial arrangement in three-dimensional hinge structure allows the antenna to operate in a zone that minimizes obstruction from the attachment leaves while maintaining compact device integration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If hinge structure is used for device configuration, then adaptability is improved, but mmW signal directionality and communication reliability deteriorate due to occlusion

Engineering Contradiction:
Improvedevice configuration flexibilityVSAvoidcommunication reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The hinge structure enables dynamic adjustment of device configuration through rotational movement of the first and second joints, allowing the mmW antenna array to change its orientation and beam direction. This dynamic positioning capability maintains communication reliability by allowing the antenna to point toward the base station even as the device configuration changes, preventing persistent signal occlusion.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The hinge structure serves multiple functions: it provides mechanical configuration flexibility for the device while simultaneously serving as a mounting structure for the mmW antenna array. The shared plane formed by the central leaves creates a universal platform that supports both the mechanical articulation and the wireless communication functions.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If mmW module is integrated with hinge, then device complexity is reduced, but heat management becomes more challenging due to confined space

Engineering Contradiction:
Improvedevice complexityVSAvoidheat dissipation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The mmW module is integrated with the hinge structure, merging the mechanical articulation function and the wireless communication function into a single unified component. This integration reduces overall device complexity by eliminating separate mounting structures while the antenna array is positioned in the shared plane of the hinge to maintain thermal management effectiveness.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves communication performance and heat dissipation in hinged devices, optimizing space usage and maintaining effective wireless communication across various device configurations.

Implementation Method 1

the mmW module is mounted to a heatsink coupled to the central leaf of the first joint or the central leaf of the second joint

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12573743B2Millimeter wave (mmW) integrated hinge
Publication Date: 2026.03.10 QUALCOMM INC
  • US12573743B2 patent drawing
  • US12573743B2 patent drawing
  • US12573743B2 patent drawing

AI summary

Aspects described herein include millimeter wave integrated hinges. In one aspect, wireless communication apparatus includes a bracket, a first pivot structure attached to the bracket configured to pivot the bracket around a first line, and a second pivot structure attached to the bracket and configured to pivot the bracket around a second line, wherein the second line is parallel to the first line. A millimeter wave antenna array is mounted to the bracket such that the mmW antenna array is positioned between the first line and the second line.