Modular Millimeter Wave Power Source Using Wavefront Expansion
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Solution Overview
Problem
High power sources for W-band millimeter wave (MMW) applications are typically bulky, expensive, and non-portable due to the use of magnetrons or gyrotrons, while semiconductor devices offer limited power output, necessitating the development of more efficient power combining methods.
Innovation Solution
A modular power source module comprising a plurality of submodules with circuit devices, including amplitude adjusters, phase shifters, and amplifiers, which use wavefront expanders and power dividers to spatially combine MMW power output from multiple semiconductor devices, enabling higher power output in a more compact and portable form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If tube sources (magnetrons or gyrotrons) are used for high power MMW output, then power output is improved, but device size, weight, and cost increase
Solution Approach 1:
The patent divides the high power MMW source into multiple independent semiconductor device modules, each contributing a portion of the total power output. This segmentation allows the system to achieve high power levels through combination rather than relying on a single large tube source, thereby reducing overall device size and weight while maintaining portability.
Solution Approach 2:
The patent combines the power output from multiple semiconductor devices using wavefront combining techniques. By merging the output from multiple smaller devices, the system achieves the high power levels traditionally requiring tube sources, but with the size and weight benefits of solid-state devices.
2Power
If multiple semiconductor devices are combined to increase power output, then power is improved, but device complexity increases
Solution Approach 1:
The system is divided into identical or similar modular units, each containing semiconductor devices and associated control circuitry. This segmentation into standardized modules simplifies the overall system architecture compared to a monolithic design, as each module can be independently designed, tested, and assembled.
Solution Approach 2:
The patent employs dynamic control of amplitude and phase for each semiconductor device module to optimize power combining efficiency. This dynamic adjustment allows the system to maintain optimal performance across varying operating conditions while managing the complexity through automated control algorithms.
3Power
If tube sources are used, then high power output is achieved, but portability deteriorates
Solution Approach 1:
The patent employs solid-state semiconductor devices that are inherently more portable and less fragile than tube sources. These solid-state devices can be integrated into compact modules that are easier to transport and require less stringent handling, thereby improving portability while maintaining high power output capability through multi-device combination.
Data Source
AI summary
A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.